Issued Patents All Time
Showing 26–50 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9331019 | Device comprising a ductile layer and method of making the same | Reinhard Pufall | 2016-05-03 |
| 9269685 | Integrated circuit package and packaging methods | Frank Daeche | 2016-02-23 |
| 9249014 | Packaged nano-structured component and method of making a packaged nano-structured component | Khalil Hosseini, Joachim Mahler | 2016-02-02 |
| 9190389 | Chip package with passives | Joachim Mahler, Khalil Hosseini | 2015-11-17 |
| 9171804 | Method for fabricating an electronic component | Khalil Hosseini, Joachim Mahler, Edward Fuergut | 2015-10-27 |
| 9171787 | Packaged semiconductor device having an embedded system | Khalil Hosseini, Joachim Mahler | 2015-10-27 |
| 9159777 | Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil | — | 2015-10-13 |
| 9123544 | Semiconductor device and method | Christian Birzer | 2015-09-01 |
| 9111847 | Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package | — | 2015-08-18 |
| 9105562 | Integrated circuit package and packaging methods | Frank Daeche | 2015-08-11 |
| 9082767 | Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package | Joachim Mahler, Edward Fuergut, Khalil Hosseini | 2015-07-14 |
| 9070568 | Chip package with embedded passive component | Khalil Hosseini, Joachim Mahler | 2015-06-30 |
| 9041226 | Chip arrangement and a method of manufacturing a chip arrangement | Rainer Steiner, Edward Fuergut, Khalil Hosseini, Joachim Mahler | 2015-05-26 |
| 8896128 | Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit | Khalil Hosseini, Joachim Mahler | 2014-11-25 |
| 8692361 | Electric device package comprising a laminate and method of making an electric device package comprising a laminate | Joachim Mahler, Edward Fuergut, Khalil Hosseini | 2014-04-08 |
| 8680668 | Device including a semiconductor chip and metal foils | Andreas Schloegl | 2014-03-25 |
| 8669175 | Semiconductor device and manufacturing of the semiconductor device | — | 2014-03-11 |
| 8652866 | Sensor device and method | Klaus Elian, Horst Theuss | 2014-02-18 |
| 8648456 | Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package | Joachim Mahler, Edward Fuergut, Khalil Hosseini | 2014-02-11 |
| 8610274 | Die structure, die arrangement and method of processing a die | Khalil Hosseini, Frank Kahlmann, Josef Hoeglauer, Ralf Otremba | 2013-12-17 |
| 8580612 | Chip assembly | Horst Theuss | 2013-11-12 |
| 8513771 | Semiconductor package with integrated inductor | Klaus Elian, Horst Theuss | 2013-08-20 |
| 8373240 | Sensor device having a structure element | Klaus Elian, Horst Theuss | 2013-02-12 |
| 8338231 | Encapsulated semiconductor chip with external contact pads and manufacturing method thereof | — | 2012-12-25 |
| 8264085 | Semiconductor device package interconnections | — | 2012-09-11 |