Issued Patents All Time
Showing 251–272 of 272 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6332270 | Method of making high density integral test probe | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 2001-12-25 |
| 6329827 | High density cantilevered probe for electronic devices | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih | 2001-12-11 |
| 6300780 | High density integrated circuit apparatus, test probe and methods of use thereof | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 2001-10-09 |
| 6295729 | Angled flying lead wire bonding process | Brian S. Beaman, Paul A. Lauro, Da-Yuan Shih | 2001-10-02 |
| 6286208 | Interconnector with contact pads having enhanced durability | Da-Yuan Shih, Paul A. Lauro, Brian S. Beaman, Maurice Heathcote Norcott | 2001-09-11 |
| 6206273 | Structures and processes to create a desired probetip contact geometry on a wafer test probe | Brian S. Beaman, Paul A. Lauro, Da-Yuan Shih | 2001-03-27 |
| 6104201 | Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 2000-08-15 |
| 6078500 | Pluggable chip scale package | Brian S. Beaman, Paul A. Lauro, Da-Yuan Shih | 2000-06-20 |
| 6062879 | High density test probe with rigid surface structure | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih | 2000-05-16 |
| 6054651 | Foamed elastomers for wafer probing applications and interposer connectors | James L. Hedrick, Paul A. Lauro, Yun-Hsin Liao, Da-Yuan Shih | 2000-04-25 |
| 5914614 | High density cantilevered probe for electronic devices | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih | 1999-06-22 |
| 5898991 | Methods of fabrication of coaxial vias and magnetic devices | Jeffrey Hedrick, David Lewis, Eva E. Simonyi, Alfred Viehbeck, Stanley Joseph Whitehair | 1999-05-04 |
| 5838160 | Integral rigid chip test probe | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 1998-11-17 |
| 5821763 | Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 1998-10-13 |
| 5810607 | Interconnector with contact pads having enhanced durability | Da-Yuan Shih, Paul A. Lauro, Brian S. Beaman, Maurice Heathcote Norcott | 1998-09-22 |
| 5811982 | High density cantilevered probe for electronic devices | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yaun Shih | 1998-09-22 |
| 5785538 | High density test probe with rigid surface structure | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih | 1998-07-28 |
| 5635846 | Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 1997-06-03 |
| 5541567 | Coaxial vias in an electronic substrate | Jeffrey Hedrick, David Lewis, Eva E. Simonyi, Alfred Viehbeck, Stanley Joseph Whitehair | 1996-07-30 |
| 5531022 | Method of forming a three dimensional high performance interconnection package | Brain S. Beaman, Fuad E. Doany, James L. Hedrick, Paul A. Lauro, Maurice Heathcote Norcott +4 more | 1996-07-02 |
| 5371654 | Three dimensional high performance interconnection package | Brian S. Beaman, Fuad E. Doany, James L. Hedrick, Paul A. Lauro, Maurice Heathcote Norcott +4 more | 1994-12-06 |
| 4975079 | Connector assembly for chip testing | Brian S. Beaman, Jungihl Kim, Wolfgang Mayr, Jane M. Shaw, George F. Walker | 1990-12-04 |