Issued Patents All Time
Showing 51–75 of 123 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10834839 | Barrier for hybrid socket movement reduction | Theron Lee Lewis, Timothy J. Jennings, Timothy P. Younger, David J. Braun, Jennifer I. Bennett +2 more | 2020-11-10 |
| 10762811 | Universal projector | Layne A. Berge, Matthew S. Doyle, Kyle Schoneck, Jason J. Bjorgaard, Thomas W. Liang | 2020-09-01 |
| 10685146 | Overlapping, discrete tamper-respondent sensors | William L. Brodsky, Phillip Duane Isaacs, David C. Long, Michael T. Peets | 2020-06-16 |
| 10677856 | Facilitating reliable circuit board press-fit connector assembly fabrication | Stephen M. Hugo, Tim Bartsch, James D. Bielick, David J. Braun, Theron Lee Lewis +2 more | 2020-06-09 |
| 10663762 | Dielectric electro-active polymer contact lenses | Layne A. Berge, Matthew S. Doyle, Thomas W. Liang, Manuel Orozco | 2020-05-26 |
| 10595416 | Insertion loss reduction and increased bonding in a circuit apparatus | Brian L. Carlson, Roger S. Krabbenhoft, Kevin A. Splittstoesser | 2020-03-17 |
| 10593601 | Dye and pry process for removing quad flat no-lead packages and bottom termination components | Tim Bartsch, Jennifer I. Bennett, James D. Bielick, David J. Braun, Stephen M. Hugo +2 more | 2020-03-17 |
| 10588219 | Metallized particle interconnect with solder components | Layne A. Berge, Matthew S. Doyle, Jesse Hefner | 2020-03-10 |
| 10586465 | Determination of a change in atmospheric pressure based on radio frequency return signal | Layne A. Berge, Matthew S. Doyle, Thomas W. Liang, Manuel Orozco | 2020-03-10 |
| 10575448 | Electromagnetic shielding of heat sinks with shape-memory alloy grounding | Theron Lee Lewis, Timothy P. Younger, David J. Braun, James D. Bielick, Jennifer I. Bennett +1 more | 2020-02-25 |
| 10575398 | Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout | James A. Busby, Michael J. Fisher, David C. Long | 2020-02-25 |
| 10568202 | Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout | James A. Busby, Michael J. Fisher, David C. Long | 2020-02-18 |
| 10531561 | Enclosure-to-board interface with tamper-detect circuit(s) | Kathleen Ann Fadden, James A. Busby, David C. Long, Alexandra Echegaray, Michael J. Fisher +1 more | 2020-01-07 |
| 10479322 | Wiper control mechanism | Thomas D. Kidd | 2019-11-19 |
| 10430615 | Secure crypto module including optical security pathway | Layne A. Berge, Matthew S. Doyle, Thomas W. Liang, Manuel Orozco | 2019-10-01 |
| 10423809 | Location sensing for analytical applications | Layne A. Berge, Matthew S. Doyle, Thomas W. Liang, Manuel Orozco | 2019-09-24 |
| 10395067 | Method of fabricating a tamper-respondent sensor assembly | William L. Brodsky, Phillip Duane Isaacs, David C. Long, Michael T. Peets | 2019-08-27 |
| 10390439 | Insertion loss reduction and increased bonding in a circuit apparatus | Brian L. Carlson, Roger S. Krabbenhoft, Kevin A. Splittstoesser | 2019-08-20 |
| 10349532 | Method for implementing stub-less printed circuit board vias | Layne A. Berge, Matthew S. Doyle, Joseph Kuczynski, Thomas W. Liang, Manuel Orozco | 2019-07-09 |
| 10331915 | Overlapping, discrete tamper-respondent sensors | William L. Brodsky, Phillip Duane Isaacs, David C. Long, Michael T. Peets | 2019-06-25 |
| 10332243 | Tampering detection for digital images | Layne A. Berge, Matthew S. Doyle, Thomas W. Liang, Manuel Orozco | 2019-06-25 |
| 10327329 | Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor | William L. Brodsky, James A. Busby, Silvio Dragone, Michael J. Fisher, David C. Long | 2019-06-18 |
| 10306753 | Enclosure-to-board interface with tamper-detect circuit(s) | Kathleen Ann Fadden, James A. Busby, David C. Long, Alexandra Echegaray, Michael J. Fisher +1 more | 2019-05-28 |
| 10271434 | Method of fabricating a tamper-respondent assembly with region(s) of increased susceptibility to damage | David C. Long, Michael T. Peets | 2019-04-23 |
| 10262907 | Dye and pry process for removing quad flat no-lead packages and bottom termination components | Tim Bartsch, Jennifer I. Bennett, James D. Bielick, David J. Braun, Stephen M. Hugo +2 more | 2019-04-16 |