Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6069068 | Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity | Hormazdyar M. Dalal, Paul S. McLaughlin, Du Nguyen, Richard G. Smith, Alexander J. Swinton +1 more | 2000-05-30 |
| 6069051 | Method of producing planar metal-to-metal capacitor for use in integrated circuits | Du Nguyen, George S. Prokop, Richard A. Wachnik, Craig R. Gruszecki | 2000-05-30 |
| 6033939 | Method for providing electrically fusible links in copper interconnection | Birendra Agarwala, Hormazdyar M. Dalal, Du Nguyen | 2000-03-07 |
| 5981374 | Sub-half-micron multi-level interconnection structure and process thereof | Hormazdyar M. Dalal, Du Nguyen | 1999-11-09 |
| 5976970 | Method of making and laterally filling key hole structure for ultra fine pitch conductor lines | Hormazdyar M. Dalal | 1999-11-02 |
| 5760595 | High temperature electromigration stress test system, test socket, and use thereof | Robert D. Edwards, Du Nguyen, James J. Poulin, Richard G. Smith | 1998-06-02 |
| 5434451 | Tungsten liner process for simultaneous formation of integral contact studs and interconnect lines | Hormazdyar M. Dalal, Kevin Hutchings | 1995-07-18 |
| 5252516 | Method for producing interlevel stud vias | Du Nguyen | 1993-10-12 |