Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171013 | Leveraging precursor molecular composition and structure for atomic layer etching | Kang-Yi Lin, Chen-Hao Li | 2021-11-09 |
| 10790157 | Achieving etching selectivity for atomic layer etching processes by utilizing material-selective deposition phenomena | Kang-Yi Lin, Chen-Hao Li | 2020-09-29 |
| 9620382 | Reactor for plasma-based atomic layer etching of materials | Dominik Metzler | 2017-04-11 |
| 7470329 | Method and system for nanoscale plasma processing of objects | Xuefeng Hua, Christian Stolz | 2008-12-30 |
| 6060400 | Highly selective chemical dry etching of silicon nitride over silicon and silicon dioxide | Bernd Kastenmeier, Peter Matsuo | 2000-05-09 |
| 5798016 | Apparatus for hot wall reactive ion etching using a dielectric or metallic liner with temperature control to achieve process stability | David Vender, Ying Zhang, Marco Haverlag | 1998-08-25 |
| 5788870 | Promotion of the adhesion of fluorocarbon films | Thao N. Nguyen, Zeev A. Weinberg | 1998-08-04 |
| 5637237 | Method for hot wall reactive ion etching using a dielectric or metallic liner with temperature control to achieve process stability | David Vender, Ying Zhang, Marco Haverlag | 1997-06-10 |
| 5549935 | Adhesion promotion of fluorocarbon films | Thao N. Nguyen, Zeev A. Weinberg | 1996-08-27 |
| 5395769 | Method for controlling silicon etch depth | Maurizio Arienzo, David L. Harame | 1995-03-07 |
| 5302420 | Plasma deposition of fluorocarbon | Thao N. Nguyen, Zeev A. Weinberg | 1994-04-12 |
| 5244730 | Plasma deposition of fluorocarbon | Thao N. Nguyen, Zeev A. Weinberg | 1993-09-14 |
| 5155657 | High area capacitor formation using material dependent etching | Vishnubhai V. Patel, Alfred Grill, Rodney T. Hodgson, Gary W. Rubloff | 1992-10-13 |
| 5153813 | High area capacitor formation using dry etching | Gary W. Rubloff | 1992-10-06 |