Issued Patents All Time
Showing 151–166 of 166 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7036709 | Method and structure for implementing column attach coupled noise suppressor | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2006-05-02 |
| 7036710 | Method and structures for implementing impedance-controlled coupled noise suppressor for differential interface solder column array | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2006-05-02 |
| 6998852 | Method and apparatus for implementing direct attenuation measurement through embedded structure excitation | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2006-02-14 |
| 6987397 | Method and probe structure for implementing a single probe location for multiple signals | Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2006-01-17 |
| 6971896 | Flex strips for high frequency connectors | Richard Ericson, Wesley D. Martin, Benjamin W. Mashak, Trevor Joseph Timpane, Ay Vang | 2005-12-06 |
| 6956383 | Method and apparatus for implementing automated electronic package transmission line characteristic impedance verification | Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2005-10-18 |
| 6842038 | Self optimizing off chip driver | Richard Ericson, Philip Raymond Germann | 2005-01-11 |
| 6757175 | Method and embedded bus bar structure for implementing power distribution | Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2004-06-29 |
| 6185646 | Method and apparatus for transferring data on a synchronous multi-drop | Wayne M. Barrett, Douglas A. Baska, Paul Eric Dahlen, Robert Allen Drehmel, Kenneth Claude Hinz +1 more | 2001-02-06 |
| 6084775 | Heatsink and package structures with fusible release layer | Douglas A. Baska, James D. Bielick, Matthew A. Butterbaugh, Mark K. Hoffmeyer, Sukhvinder S. Kang | 2000-07-04 |
| 6054749 | Thin film device repaired using enhanced repair process | Peter A. Franklin, Carmine J. Mele, Arthur G. Merryman, John R. Pennacchia, Kurt A. Smith +3 more | 2000-04-25 |
| 5972723 | Enhanced thin film wiring net repair process | Peter A. Franklin, Carmine J. Mele, Arthur G. Merryman, John R. Pennacchia, Kurt A. Smith +3 more | 1999-10-26 |
| 5937269 | Graphics assisted manufacturing process for thin-film devices | Roy Yu, Peter A. Franklin, Carmine J. Mele, Arthur G. Merryman, John R. Pennacchia +3 more | 1999-08-10 |
| 5895230 | Integrated circuit chip package having configurable contacts and method for making the same | — | 1999-04-20 |
| 5763947 | Integrated circuit chip package having configurable contacts and a removable connector | — | 1998-06-09 |
| 5727231 | Method for personalizing integrated circuit devices | Delbert R. Cecchi, Jeffrey A. Collett, Linda S. Herman, David Otto Lewis, Glenn W. Sellers | 1998-03-10 |