Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815346 | Unique feature design enabling structural integrity for advanced low k semiconductor chips | Charles R. Davis, David L. Hawken, William Francis Landers, David L. Questad | 2004-11-09 |
| 6650010 | Unique feature design enabling structural integrity for advanced low K semiconductor chips | Charles R. Davis, David L. Hawken, William Francis Landers, David L. Questad | 2003-11-18 |
| 4967690 | Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means | Edmond O. Fey, Peter Haselbauer, Ronald A. Kaschak, Hans-Dieter Kilthau, Roy H. Magnuson +1 more | 1990-11-06 |
| 4904506 | Copper deposition from electroless plating bath | Peter A. Burnett, Ronald A. Kaschak, Roy H. Magnuson, Robert G. Rickert, Stephen L. Tisdale | 1990-02-27 |
| 4869930 | Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization | Thomas Carl Clarke, Caroline A. Kovac, Jae Man Park, Richard R. Thomas | 1989-09-26 |
| 4684545 | Electroless plating with bi-level control of dissolved oxygen | Edmond O. Fey, Peter Haselbauer, Ronald A. Kaschak, Hans-Dieter Kilthau, Roy H. Magnuson +1 more | 1987-08-04 |
| 4593016 | Process for manufacturing a concentrate of a palladium-tin colloidal catalyst | William J. Amelio, Voya R. Markovich, Carlos J. Sambucetti | 1986-06-03 |