Issued Patents All Time
Showing 26–50 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8723306 | Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing method | Nobutake Tsuyuno, Hiroshi Hozoji, Tokihito Suwa, Kinya Nakatsu, Takeshi Tokuyama +1 more | 2014-05-13 |
| 8492202 | Semiconductor device and method of manufacturing the same | Ryoichi Kajiwara, Shigehisa Motowaki, Kazutoshi Ito, Katsuo Arai, Takuya Nakajo +1 more | 2013-07-23 |
| 8339795 | Transmission control apparatus and mechanically and electrically integrated type electronic control apparatus | Nobutake Tsuyuno, Itaru Tanabe, Hiroshi Kameyama | 2012-12-25 |
| 8314484 | Semiconductor device and method of manufacturing the same | Ryoichi Kajiwara, Shigehisa Motowaki, Kazutoshi Ito, Katsuo Arai, Takuya Nakajo +1 more | 2012-11-20 |
| 7955411 | Low temperature bonding material comprising metal particles and bonding method | Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Hiroshi Hozoji | 2011-06-07 |
| 7816786 | Semiconductor unit, and power conversion system and on-vehicle electrical system using the same | Kinya Nakatsu, Hideki Miyazaki, Yoshitaka Takezawa, Hiroshi Hozoji | 2010-10-19 |
| 7671462 | Power semiconductor device | Kozo Sakamoto | 2010-03-02 |
| 7608917 | Power semiconductor module | Ryoichi Kajiwara, Kazuhiro Suzuki, Kazutoshi Itou | 2009-10-27 |
| 7514780 | Power semiconductor device | Kozo Sakamoto | 2009-04-07 |
| 7504720 | Semiconductor unit, and power conversion system and on-vehicle electrical system using the same | Kinya Nakatsu, Hideki Miyazaki, Yoshitaka Takezawa, Hiroshi Hozoji | 2009-03-17 |
| 7298039 | Electronic circuit device | Nobutake Tsuyuno, Toshiya Satoh, Mitsuhiro Masuda | 2007-11-20 |
| 7217992 | Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device | Masahiko Ogino, Takumi Ueno, Shuji Eguchi, Akira Nagai, Toshiya Satoh +5 more | 2007-05-15 |
| 7165898 | Optical module, method for manufacturing optical module and optical communication apparatus | Takeshil Kato, Koji Yoshida, Toshinori Hirataka, Kazuyuki Fukuda, Tadaaki Ishikawa +3 more | 2007-01-23 |
| 7038325 | Wiring tape for semiconductor device including a buffer layer having interconnected foams | Masahiko Ogino, Shuji Eguchi, Akira Nagai, Takumi Ueno, Masanori Segawa +6 more | 2006-05-02 |
| 6888230 | Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device | Masahiko Ogino, Takumi Ueno, Shuji Eguchi, Akira Nagai, Toshiya Satoh +5 more | 2005-05-03 |
| 6878448 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | Hiroyoshi Kokaku, Akira Nagai, Takao Miwa | 2005-04-12 |
| 6791182 | Semiconductor device | Junpei Kusukawa, Ryozo Takeuchi, Hiromichi Suzuki, Fujio Ito, Takafumi Nishita +2 more | 2004-09-14 |
| 6726375 | Optical module, method for manufacturing optical module and optical communication apparatus | Takeshil Kato, Koji Yoshida, Toshinori Hirataka, Kazuyuki Fukuda, Tadaaki Ishikawa +3 more | 2004-04-27 |
| 6457877 | Optical module, method for manufacturing optical module and optical communication apparatus | Takeshil Kato, Koji Yoshida, Toshinori Hirataka, Kazuyuki Fukuda, Tadaaki Ishikawa +3 more | 2002-10-01 |
| 6433440 | Semiconductor device having a porous buffer layer for semiconductor device | Masahiko Ogino, Shuji Eguchi, Akira Nagai, Takumi Ueno, Masanori Segawa +6 more | 2002-08-13 |
| 6423571 | Method of making a semiconductor device having a stress relieving mechanism | Masahiko Ogino, Akira Nagai, Shuji Eguchi, Masanori Segawa, Haruo Akahoshi +4 more | 2002-07-23 |
| 6282352 | Optical module, method for manufacturing optical module and optical communication apparatus | Takeshi Kato, Koji Yoshida, Toshinori Hirataka, Kazuyuki Fukuda, Tadaaki Ishikawa +3 more | 2001-08-28 |
| 6220764 | Optical module, method for manufacturing optical module and optical communication apparatus | Takeshi Kato, Koji Yoshida, Toshinori Hirataka, Kazuyuki Fukuda, Tadaaki Ishikawa +3 more | 2001-04-24 |
| 6114005 | Laminate and multilayer printed circuit board | Akira Nagai, Masatsugu Ogata, Shuji Eguchi, Masahiko Ogino, Masanori Segawa +3 more | 2000-09-05 |
| 6097100 | Resin sealed semiconductor devices and a process for manufacturing the same | Shuji Eguchi, Yasuhide Sugawara, Hiroyoshi Kokaku, Akira Nagai, Ryou MOTEKI +7 more | 2000-08-01 |