Issued Patents All Time
Showing 51–71 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5788821 | Copper-based oxidation catalyst and its application | Takeyuki Itabashi, Fujiko Kinosaki, Akio Takahashi | 1998-08-04 |
| 5712080 | Method for manufacturing printed circuit board | Yuichi Satsu, Mineo Kawamoto, Akio Takahashi, Masashi Miyazaki, Toshiaki Ishimaru | 1998-01-27 |
| 5707749 | Method for producing thin film multilayer wiring board | Junichi Katagiri, Akio Takahashi, Akira Nagai, Kouji Fujisaki, Akio Mukoh +1 more | 1998-01-13 |
| 5595943 | Method for formation of conductor using electroless plating | Takeyuki Itabashi, Akio Takahashi | 1997-01-21 |
| 5565706 | LSI package board | Osamu Miura, Akio Takahashi, Takao Miwa, Masahiro Suzuki, Ryuji Watanabe +3 more | 1996-10-15 |
| 5476690 | Process for preparing printed circuit board | Fumihiko Ohta, Takeshi Nojiri, Shinji Tsuchikawa, Akio Nakano, Toshiaki Ishimaru +3 more | 1995-12-19 |
| 5472563 | Printed circuit board and method and apparatus for making same | Kiyonori Kogawa, Nobuaki Ooki, Masami Kawaguchi, Motoyo Wajima, Akira Nagai | 1995-12-05 |
| 5458763 | Method for forming wiring pattern | Shiro Kobayashi, Toshinari Takada, Tomoyuki Miyazaki, Kanji Yamamoto | 1995-10-17 |
| 5457079 | Copper-based oxidation catalyst and its applications | Takeyuki Itabashi, Fujiko Kinosaki, Akio Takahashi | 1995-10-10 |
| 5438751 | Process for producing printed wiring board | Masashi Miyazaki, Shozo Nohara, Kenzi Kikuta, Toshiaki Ishimaru | 1995-08-08 |
| 5356698 | Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same | Mineo Kawamoto, Akio Takahashi, Akio Mukoh, Kazuo Tanje, Toyofusa Yoshimura +3 more | 1994-10-18 |
| 5294291 | Process for the formation of a conductive circuit pattern | Toshinari Takada, Fujiko Yutani, Takeyuki Itabashi, Shin Nishimura, Satoru Amo +3 more | 1994-03-15 |
| 5028513 | Process for producing printed circuit board | Kanji Murakami, Mineo Kawamoto, Akio Tadokoro, Toshikazu Narahara, Ritsuji Toba +3 more | 1991-07-02 |
| 5021296 | Circuit board and process for producing the same | Yoshihiro Suzuki, Toshinari Takada, Masahiro Suzuki, Akira Nagai, Akio Takahashi +4 more | 1991-06-04 |
| 4970107 | Composite article comprising a copper element and a process for producing it | Kanji Murakami, Yoshihiro Suzuki, Akira Nagai, Kiyonori Kogawa, Akio Takahashi | 1990-11-13 |
| 4876177 | Process for producing printed circuit board | Kanji Murakami, Mineo Kawamoto, Akio Tadokoro, Toyofusa Yoshimura | 1989-10-24 |
| 4865888 | Process for electroless copper plating and apparatus used therefor | Kanji Murakami, Mineo Kawamoto, Akio Takokoro, Ritsuji Toba, Toyofusa Yoshimura | 1989-09-12 |
| 4642161 | Method of bonding copper and resin | Kanji Murakami, Motoyo Wajima, Kiyonori Kogawa, Ritsuji Toba, Takeshi Shimazaki | 1987-02-10 |
| 4632852 | Process for electroless copper plating | Kanji Murakami, Mineo Kawamoto, Motoyo Wajima, Rituji Toba, Shoji Kawakubo +1 more | 1986-12-30 |
| 4610910 | Printed circuit board, process for preparing the same and resist ink used therefor | Mineo Kawamoto, Kanji Murakami, Yoichi Matsuda, Motoyo Wajima, Makoto Matsunaga +4 more | 1986-09-09 |
| 4604160 | Method for manufacture of printed wiring board | Kanji Murakami, Mineo Kawamoto, Motoyo Wajima, Yoichi Matsuda, Kyoji Kawakubo +3 more | 1986-08-05 |