Issued Patents All Time
Showing 26–50 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7220481 | High dielectric constant composite material and multilayer wiring board using the same | Yuichi Satsu, Akio Takahashi, Tadashi Fujieda, Takumi Ueno | 2007-05-22 |
| 7170012 | Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus | Tokihito Suwa, Shingo Kumamoto | 2007-01-30 |
| 7169216 | Electroless copper plating solution, electroless copper plating process and production process of circuit board | Takeyuki Itabashi, Hiroshi Kanemoto, Eiji Takai, Naoki Nishimura, Tadashi Iida +1 more | 2007-01-30 |
| 7095623 | Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus | Tokihito Suwa, Shingo Kumamoto | 2006-08-22 |
| 7022412 | Member having metallic layer, its manufacturing method and its application | Hiroshi Yoshida, Toshiro Saito | 2006-04-04 |
| 6989329 | Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections | Takeyuki Itabashi, Eiji Takai, Naoki Nishimura, Tadashi Iida, Yoshinori Ueda | 2006-01-24 |
| 6940162 | Semiconductor module and mounting method for same | Shuji Eguchi, Akira Nagai, Takumi Ueno, Toshiya Satoh, Masahiko Ogino +3 more | 2005-09-06 |
| 6924971 | High dielectric constant composite material and multilayer wiring board using the same | Yuichi Satsu, Akio Takahashi, Tadashi Fujieda, Takumi Ueno | 2005-08-02 |
| 6900394 | Electroless copper plating machine, and multi-layer printed wiring board | Takeyuki Itabashi, Tadashi Iida, Yoshinori Ueda, Eiji Takai, Naoki Nishimura | 2005-05-31 |
| 6831009 | Wiring substrate and an electroless copper plating solution for providing interlayer connections | Takeyuki Itabashi, Eiji Takai, Naoki Nishimura, Tadashi Iida, Yoshinori Ueda | 2004-12-14 |
| 6815357 | Process and apparatus for manufacturing a semiconductor device | Yoshio Homma, Noriyuki Sakuma, Hiroshi Nakano, Takeyuki Itabashi | 2004-11-09 |
| 6805915 | Electroless copper plating solution, electroless copper plating process and production process of circuit board | Takeyuki Itabashi, Hiroshi Kanemoto, Eiji Takai, Naoki Nishimura, Tadashi Iida +1 more | 2004-10-19 |
| 6784541 | Semiconductor module and mounting method for same | Shuji Eguchi, Akira Nagai, Takumi Ueno, Toshiya Satoh, Masahiko Ogino +3 more | 2004-08-31 |
| 6710446 | Semiconductor device comprising stress relaxation layers and method for manufacturing the same | Akira Nagai, Takumi Ueno, Syuji Eguchi, Masahiko Ogino, Toshiya Satoh +2 more | 2004-03-23 |
| 6680540 | Semiconductor device having cobalt alloy film with boron | Hiroshi Nakano, Takeyuki Itabashi | 2004-01-20 |
| 6627997 | Semiconductor module and method of mounting | Shuji Eguchi, Akira Nagai, Takumi Ueno, Toshiya Satoh, Masahiko Ogino +3 more | 2003-09-30 |
| 6511588 | Plating method using an additive | Kinya Kobayashi, Akihiro Sano, Takeyuki Itabashi, Toshio Haba, Shinichi Fukada | 2003-01-28 |
| 6495769 | Wiring board and production method thereof, and semiconductor apparatus | Toshiro Saito, Takeyuki Itabashi | 2002-12-17 |
| 6475680 | Lithium secondary battery, its electrolyte, and electric apparatus using the same | Juichi Arai, Hideaki Katayama, Tomoe Takamura, Takao Iwayanagi | 2002-11-05 |
| 6423571 | Method of making a semiconductor device having a stress relieving mechanism | Masahiko Ogino, Akira Nagai, Shuji Eguchi, Toshiaki Ishii, Masanori Segawa +4 more | 2002-07-23 |
| 6396145 | Semiconductor device and method for manufacturing the same technical field | Akira Nagai, Takumi Ueno, Syuji Eguchi, Masahiko Ogino, Toshiya Satoh +2 more | 2002-05-28 |
| 6300244 | Semiconductor device and method of manufacturing the same | Takeyuki Itabashi, Toshio Haba | 2001-10-09 |
| 6132852 | Multilayer wiring substrate and method for production thereof | Masahiro Suzuki, Akio Takahashi, Minoru Tanaka, Haruhiko Matsuyama | 2000-10-17 |
| 6028364 | Semiconductor device having a stress relieving mechanism | Masahiko Ogino, Akira Nagai, Shuji Eguchi, Toshiaki Ishii, Masanori Segawa +4 more | 2000-02-22 |
| 5919603 | Process for producing printed wiring board | Masashi Miyazaki, Shozo Nohara, Kenzi Kikuta, Toshiaki Ishimaru | 1999-07-06 |