Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12371792 | Laminate, metal plating solution, and manufacturing process of laminate | Takuya Aoyagi, Tomio Iwasaki, Toshinori Kawamura, Hitoshi Suzuki | 2025-07-29 |
| 11279112 | Coating laminated body and method for producing the same | Toshinori Kawamura | 2022-03-22 |
| 10836138 | Laminated body having corrosion-resistant coating, and method for manufacturing same | Katsumi Mabuchi, Hiroshi Nakano | 2020-11-17 |
| 9829458 | Electrode for electrochemical measurement, electrolysis cell for electrochemical measurement, analyzer for electrochemical measurement, and methods for producing same | Hauro Akahoshi, So OGUCHI, Kenta Imai, Taku Sakazume, Hiroshi Yoshida | 2017-11-28 |
| 9234861 | Electrode for electrochemical measurement, electrolysis cell for electrochemical measurement, analyzer for electrochemical measurement, and methods for producing same | Haruo Akahoshi, So OGUCHI, Kenta Imai, Taku Sakazume, Hiroshi Yoshida | 2016-01-12 |
| 8307863 | Fuel filling and waste solution recovery apparatus and fuel vessel | Masafumi Noujima, Takeyuki Itabashi, Takao Ishikawa, Shinji Yamada | 2012-11-13 |
| 8197752 | Managing system and method for emissions of environmental pollutants | Masafumi Nojima, Takeyuki Itabashi, Takao Ishikawa | 2012-06-12 |
| 8109286 | Fuel tank including movable or deformable fuel chamber and waste chamber | Masafumi Nojima, Takao Ishikawa, Takeyuki Itabashi | 2012-02-07 |
| 7568452 | Engine system | Atsushi Shimada, Takao Ishikawa, Takeyuki Itabashi | 2009-08-04 |
| 7527660 | Hydrogen fuel manufacturing method and system with control program for use therein | Masafumi Noujima, Takeyuki Itabashi, Takao Ishikawa | 2009-05-05 |
| 7169216 | Electroless copper plating solution, electroless copper plating process and production process of circuit board | Takeyuki Itabashi, Haruo Akahoshi, Eiji Takai, Naoki Nishimura, Tadashi Iida +1 more | 2007-01-30 |
| 6805915 | Electroless copper plating solution, electroless copper plating process and production process of circuit board | Takeyuki Itabashi, Haruo Akahoshi, Eiji Takai, Naoki Nishimura, Tadashi Iida +1 more | 2004-10-19 |