Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5053280 | Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 PPM or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent | Shin Takanezawa, Yorio Iwasaki, Hiroshi Takaahashi, Saburo Amano, Hiroyoshi Yokoyama +2 more | 1991-10-01 |
| 4902551 | Process for treating copper surface | Akishi Nakaso, Haruo Ogino, Tomoko Watanabe, Yuko Kimura | 1990-02-20 |
| 4859505 | Process for metallizing glass surface | Hajime Nakayama, Kouichi Tsuyama | 1989-08-22 |
| 4842899 | Process for forming metallic film on inorganic material | Yoshiyuki Tsuru, Tetsuya Okishima, Masayoshi Ikeda, Masahiro Kawamura | 1989-06-27 |
| 4643793 | Process for treating metal surface | Akishi Nakaso, Youichi Kaneko, Kiyoshi Yamanoi | 1987-02-17 |
| 4557762 | Electroless copper plating solution | Akishi Nakaso, Kiyoshi Yamanoi, Sumiko Nakajima | 1985-12-10 |
| 4548644 | Electroless copper deposition solution | Akishi Nakaso, Kiyoshi Yamanoi, Yoshiyuki Tsuru | 1985-10-22 |
| 4216246 | Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards | Yorio Iwasaki, Akishi Nakaso, Nobuo Uozu, Hiroshi Takahashi | 1980-08-05 |