| 7701743 |
Electronic circuit package |
Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka |
2010-04-20 |
| 7425763 |
Electronic circuit package |
Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka |
2008-09-16 |
| 7233534 |
Electronic circuit package |
Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka |
2007-06-19 |
| 7120069 |
Electronic circuit package |
Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka |
2006-10-10 |
| 6728904 |
Electronic circuit package |
Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka |
2004-04-27 |
| 6584004 |
Electronic circuit package |
Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka |
2003-06-24 |
| 6223273 |
Electronic circuit package |
Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka |
2001-04-24 |
| 6195742 |
Semiconductor multi-chip module |
Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka |
2001-02-27 |
| 5789805 |
Semiconductor multi-chip module |
Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka |
1998-08-04 |
| 5614761 |
Electronic circuit package including plural semiconductor chips formed on a wiring substrate |
Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka |
1997-03-25 |
| 5468992 |
Electronic circuit package including plural bare chips mounted on a single wiring substrate |
Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka |
1995-11-21 |
| 4842899 |
Process for forming metallic film on inorganic material |
Yoshiyuki Tsuru, Toshiro Okamura, Masayoshi Ikeda, Masahiro Kawamura |
1989-06-27 |