HY

Hisayoshi Yamanaka

HI Hitachi: 10 patents #4,206 of 28,497Top 15%
RS Rising Silicon: 1 patents #3 of 20Top 15%
Overall (All Time): #468,224 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
7701743 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Tetsuya Okishima 2010-04-20
7425763 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Tetsuya Okishima 2008-09-16
7233534 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Tetsuya Okishima 2007-06-19
7120069 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Tetsuya Okishima 2006-10-10
6728904 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Tetsuya Okishima 2004-04-27
6584004 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Tetsuya Okishima 2003-06-24
6223273 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Tetsuya Okishima 2001-04-24
6195742 Semiconductor multi-chip module Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Tetsuya Okishima 2001-02-27
5789805 Semiconductor multi-chip module Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Tetsuya Okishima 1998-08-04
5614761 Electronic circuit package including plural semiconductor chips formed on a wiring substrate Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Tetsuya Okishima 1997-03-25
5468992 Electronic circuit package including plural bare chips mounted on a single wiring substrate Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Tetsuya Okishima 1995-11-21