KK

Kiyoshi Kawabata

HI Hitachi: 10 patents #4,206 of 28,497Top 15%
RE Renesas Electronics: 2 patents #1,855 of 4,529Top 45%
FL Fujitsu Toshiba Mobile Communications Limited: 1 patents #30 of 113Top 30%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
Mitsubishi Electric: 1 patents #15,491 of 25,717Top 65%
RS Rising Silicon: 1 patents #3 of 20Top 15%
Overall (All Time): #300,407 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8269295 Magnetic memory device having a recording layer Takashi Takenaga, Takeharu Kuroiwa, Hiroshi Takada, Shuichi Ueno 2012-09-18
8013407 Magnetic memory device having a recording layer Takashi Takenaga, Takeharu Kuroiwa, Hiroshi Takada, Shuichi Ueno 2011-09-06
7890148 Mobile station used for CDMA mobile communication systems Masayuki Enoki 2011-02-15
7701743 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Hisayoshi Yamanaka, Tetsuya Okishima 2010-04-20
7425763 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Hisayoshi Yamanaka, Tetsuya Okishima 2008-09-16
7289832 Mobile station used for CDMA mobile communication systems Masayuki Enoki 2007-10-30
7233534 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Hisayoshi Yamanaka, Tetsuya Okishima 2007-06-19
7120069 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Hisayoshi Yamanaka, Tetsuya Okishima 2006-10-10
6728904 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Hisayoshi Yamanaka, Tetsuya Okishima 2004-04-27
6584004 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Hisayoshi Yamanaka, Tetsuya Okishima 2003-06-24
6223273 Electronic circuit package Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Hisayoshi Yamanaka, Tetsuya Okishima 2001-04-24
6195742 Semiconductor multi-chip module Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Hisayoshi Yamanaka, Tetsuya Okishima 2001-02-27
5789805 Semiconductor multi-chip module Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Hisayoshi Yamanaka, Tetsuya Okishima 1998-08-04
5614761 Electronic circuit package including plural semiconductor chips formed on a wiring substrate Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Hisayoshi Yamanaka, Tetsuya Okishima 1997-03-25
5468992 Electronic circuit package including plural bare chips mounted on a single wiring substrate Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Hisayoshi Yamanaka, Tetsuya Okishima 1995-11-21
5100478 Solar cell — 1992-03-31