Issued Patents All Time
Showing 76–86 of 86 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6328844 | Filmy adhesive for connecting circuits and circuit board | Itsuo Watanabe, Kenzo Takemura, Osamu Watanabe, Naoyuki Shiozawa, Akira Nagai +2 more | 2001-12-11 |
| 6265782 | Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film | Yasushi Shimada, Yasushi Kumashiro, Teiichi Inada, Hiroyuki Kuriya, Aizo Kaneda +5 more | 2001-07-24 |
| 6223429 | Method of production of semiconductor device | Aizou Kaneda, Masaaki Yasuda, Itsuo Watanabe, Tomohisa Ohta, Fumio Inoue +9 more | 2001-05-01 |
| 6197149 | Production of insulating varnishes and multilayer printed circuit boards using these varnishes | Kazuhito Kobayashi, Yasushi Kumashiro, Atsushi Takahashi, Koji Morita, Takahiro Tanabe +6 more | 2001-03-06 |
| 6184577 | Electronic component parts device | Kenzo Takemura, Itsuo Watanabe, Akira Nagai, Osamu Watanabe, Kazuyoshi Kojima +4 more | 2001-02-06 |
| 6090468 | Multilayer wiring board for mounting semiconductor device and method of producing the same | Yasushi Shimada, Yasushi Kumashiro, Teiichi Inada | 2000-07-18 |
| 5965269 | Adhesive, adhesive film and adhesive-backed metal foil | Teiichi Inada, Yasushi Shimada, Yasushi Kumashiro | 1999-10-12 |
| 5885723 | Bonding film for printed circuit boards | Atsushi Takahashi, Shinji Ogi, Koji Morita, Ken Nanaumi, Kiyoshi Hirosawa +4 more | 1999-03-23 |
| 5690837 | Process for producing multilayer printed circuit board | Akishi Nakaso, Koichi Tsuyama, Kazuhisa Otsuka, Haruo Ogino, Yoshihiro Tamura +5 more | 1997-11-25 |
| 5438393 | Powder fluidity detecting apparatus which includes a piezoelectric element | Katsuaki Komatsu, Shinichi Nishi | 1995-08-01 |
| 4741948 | Composite release sheet material | Toshiharu Konishi, Hadekazu Takashashi, Yoshitsugu Hasegawa, Kenji Sano, Hideyuki Okada | 1988-05-03 |