Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8987103 | Multi-step deposition of a spacer material for reducing void formation in a dielectric material of a contact level of a semiconductor device | Markus Lenski, Kerstin Ruttloff, Frank Seliger, Ralf Otterbach | 2015-03-24 |
| 8772843 | Oxide deposition by using a double liner approach for reducing pattern density dependence in sophisticated semiconductor devices | Stephan Kronholz, Markus Lenski, Kerstin Ruttloff | 2014-07-08 |
| 8415257 | Enhanced adhesion of PECVD carbon on dielectric materials by providing an adhesion interface | Hartmut Ruelke | 2013-04-09 |
| 8338284 | Stress engineering in a contact level of semiconductor devices by stressed conductive layers and an isolation spacer | Kai Frohberg, Hartmut Ruelke, Joerg Hohage, Frank Seliger | 2012-12-25 |