Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8673050 | Conductive material, conductive paste, circuit board, and semiconductor device | Taiji Sakai | 2014-03-18 |
| 8556157 | Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same | Toshiya Akamatsu, Masateru Koide | 2013-10-15 |
| 7984841 | Member formed with coating film having tin as its main component, coating film forming method and soldering method | — | 2011-07-26 |
| 7931760 | Whiskerless plated structure and plating method | Kozo Shimizu | 2011-04-26 |
| 7926696 | Composition | — | 2011-04-19 |
| 7879713 | Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode | Joji Fujimori, Toshiya Akamatsu | 2011-02-01 |
| 7743966 | Soldering flux and method for bonding semiconductor element | Toshiya Akamatsu | 2010-06-29 |
| 7189927 | Electronic component with bump electrodes, and manufacturing method thereof | — | 2007-03-13 |
| 7119000 | Method of manufacturing semiconductor device | Kozo Shimizu | 2006-10-10 |
| 6873056 | Electrode-to-electrode bond structure | Nobuhiro Imaizumi, Tomohisa Yagi | 2005-03-29 |
| 6689639 | Method of making semiconductor device | Masayuki Ochiai, Ichiro Yamaguchi, Joji Fujimori | 2004-02-10 |
| 6670264 | Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby | Nobuhiro Imaizumi, Tomohisa Yagi | 2003-12-30 |
| 6630742 | Method for forming bumps, semiconductor device, and solder paste | — | 2003-10-07 |
| 6580169 | Method for forming bumps, semiconductor device, and solder paste | Yasuo Yamagishi, Masataka Mizukoshi | 2003-06-17 |
| 6524943 | Method of forming metal bumps | — | 2003-02-25 |
| 6518163 | Method for forming bumps, semiconductor device, and solder paste | Yasuo Yamagishi, Masataka Mizukoshi | 2003-02-11 |
| 6461953 | Solder bump forming method, electronic component mounting method, and electronic component mounting structure | Hiroki Uchida | 2002-10-08 |
| 6345757 | Reflow soldering method | Taro Matsuoka | 2002-02-12 |
| 6275750 | Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace | Hiroki Uchida | 2001-08-14 |
| 6135344 | Reflow soldering method and a reflow soldering furnace | Taro Matsuoka | 2000-10-24 |
| 5770835 | Process and apparatus and panel heater for soldering electronic components to printed circuit board | Hiroki Uchida, Isao Watanabe | 1998-06-23 |
| 5607609 | Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering | Hiroki Uchida, Isao Watanabe | 1997-03-04 |