Issued Patents All Time
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9323144 | Method for microcontact printing | Gerald Kreindl, Mustapha Chouiki | 2016-04-26 |
| 9312161 | Accommodating device for retaining wafers | Thomas Wagenleitner, Alexander Filbert | 2016-04-12 |
| 9305813 | Pressure transmitting device for bonding chips onto a substrate | Alfred Sigl | 2016-04-05 |
| 9252042 | Method for permanent bonding of wafers | Thomas Plach, Kurt Hingerl, Christoph Flotgen | 2016-02-02 |
| 9245869 | Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements | Jurgen Burggraf, Harald Wiesbauer, Alfred Sigl | 2016-01-26 |
| 9224630 | Method for producing a wafer provided with chips | Jurgen Burggraf, Harald Wiesbauer | 2015-12-29 |
| 9159717 | Method for permanently bonding wafers | Thomas Plach, Kurt Hingerl, Christoph Flotgen | 2015-10-13 |
| 9138978 | Device for separating a substrate from a carrier substrate | Friedrich Paul Lindner | 2015-09-22 |
| 9116424 | Device for embossing of substrates | Friedrich Paul Lindner, Thomas Glinsner | 2015-08-25 |
| 9067363 | Method and device for permanent bonding of wafers, as well as cutting tool | Klaus Martinschitz, Bernhard Rebhan | 2015-06-30 |
| 9052422 | Method and device for producing a microlens | Erich Thallner, Michael Kast | 2015-06-09 |
| 8975158 | Method for permanently bonding wafers | Thomas Plach, Kurt Hingerl, Christoph Flotgen | 2015-03-10 |
| 8932910 | Method for producing chip stacks, and a carrier for carrying out the method | — | 2015-01-13 |
| 8927335 | Method for bonding of chips on wafers | — | 2015-01-06 |
| 8763239 | System for uniform structuring of substrates | Friedrich Paul Lindner, Thomas Glinsner | 2014-07-01 |
| 8640548 | Apparatus, device and method for determining alignment errors | — | 2014-02-04 |
| 8597980 | Method for bonding of chips on wafers | — | 2013-12-03 |
| 8449716 | Device and method for separating a substrate from a carrier substrate | Friedrich Paul Lindner | 2013-05-28 |