Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163681 | Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation | Klaus Martinschitz, Markus Wimplinger, Kurt Hingerl | 2018-12-25 |
| 9947638 | Device and method for permanent bonding | Markus Wimplinger | 2018-04-17 |
| 9640510 | Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas | — | 2017-05-02 |
| 9500541 | Method and device for determining the pressure distribution for bonding | Markus Wimplinger, Jurgen Burggraf | 2016-11-22 |
| 9443820 | Device and method for bonding substrates | — | 2016-09-13 |
| 9358765 | Method for coating and bonding substrates | Markus Wimplinger | 2016-06-07 |
| 9067363 | Method and device for permanent bonding of wafers, as well as cutting tool | Klaus Martinschitz, Markus Wimplinger | 2015-06-30 |