KH

Kurt Hingerl

EG Ev Group E. Thallner Gmbh: 8 patents #14 of 65Top 25%
OG Osram Opto Semiconductors Gmbh: 1 patents #707 of 1,154Top 65%
Overall (All Time): #541,929 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11862466 Method and device for bonding substrates Peter Nikolaus Oberhumer, Gunther Hesser 2024-01-02
11694977 Method for producing a connection between component parts Simeon Katz, Sophia Huppmann, Michael Hoenle, Thorsten Wagner 2023-07-04
10971365 Method and device for bonding substrates Peter Nikolaus Oberhumer, Gunther Hesser 2021-04-06
10825793 Method for permanently bonding wafers Thomas Plach, Markus Wimplinger, Christoph Flotgen 2020-11-03
10163681 Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation Klaus Martinschitz, Markus Wimplinger, Bernhard Rebhan 2018-12-25
10083933 Method for permanent bonding of wafers Thomas Plach, Markus Wimplinger, Christoph Flotgen 2018-09-25
9252042 Method for permanent bonding of wafers Thomas Plach, Markus Wimplinger, Christoph Flotgen 2016-02-02
9159717 Method for permanently bonding wafers Thomas Plach, Markus Wimplinger, Christoph Flotgen 2015-10-13
8975158 Method for permanently bonding wafers Thomas Plach, Markus Wimplinger, Christoph Flotgen 2015-03-10