MW

Markus Wimplinger

EG Ev Group E. Thallner Gmbh: 59 patents #1 of 65Top 2%
EG Ev Group Gmbh: 9 patents #3 of 16Top 20%
Overall (All Time): #30,886 of 4,157,543Top 1%
68
Patents All Time

Issued Patents All Time

Showing 25 most recent of 68 patents

Patent #TitleCo-InventorsDate
12135500 Stamp and method for embossing Gerald Mittendorfer 2024-11-05
12107057 Method for permanent connection of two metal surfaces Viorel Dragoi 2024-10-01
11990463 Device for bonding chips 2024-05-21
11862487 Device and method for bonding of two substrates Florian Kurz, Viorel Dragoi 2024-01-02
11776842 Method and device for surface treatment of substrates 2023-10-03
11764198 Method and device for bonding of chips 2023-09-19
11756818 Accommodating device for retaining wafers Thomas Wagenleitner, Alexander Filbert 2023-09-12
11697281 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2023-07-11
11562912 Device and method for bonding of two substrates Florian Kurz, Viorel Dragoi 2023-01-24
11355374 Accommodating device for retaining wafers Thomas Wagenleitner, Alexander Filbert 2022-06-07
11348825 Method and device for surface treatment of substrates 2022-05-31
11282801 Method for permanent connection of two metal surfaces Viorel Dragoi 2022-03-22
11276589 Device and method for bonding of two substrates Florian Kurz, Viorel Dragoi 2022-03-15
11139170 Apparatus and method for bonding substrates Viorel Dragoi, Christoph Flotgen 2021-10-05
11059280 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2021-07-13
11020950 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2021-06-01
11020953 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2021-06-01
11020952 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2021-06-01
11020951 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2021-06-01
10964562 Device and method for bonding of two substrates Florian Kurz, Viorel Dragoi 2021-03-30
10886156 Accomodating device for retaining wafers Thomas Wagenleitner, Alexander Filbert 2021-01-05
10825793 Method for permanently bonding wafers Thomas Plach, Kurt Hingerl, Christoph Flotgen 2020-11-03
10796944 Method and device for surface treatment of substrates 2020-10-06
10668678 Die tool, device and method for producing a lens wafer Michael Kast 2020-06-02
10490439 Method and device for surface treatment of substrates 2019-11-26