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Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ev Group E. Thallner Gmbh › Markus Wimplinger
MW

Markus Wimplinger — 70 Patents

EGEv Group E. Thallner Gmbh: 59 patents #1 of 65Top 2%
EGEv Group Gmbh: 9 patents #3 of 16Top 20%
Ried im Innkreis, AT: #1 of 149 inventorsTop 1%
Overall (All Time): #29,186 of 4,157,543Top 1%
70 Patents All Time
Markus Wimplinger has been granted 70 US patents while listed as an inventor at Ev Group E. Thallner Gmbh. The first was granted in 2013 and the most recent in November 2025. Markus Wimplinger ranks #29,186 of 4,157,543 US inventors in our database (top 0.70%). Patent records list Markus Wimplinger in Ried im Innkreis, AT.

Patents per Year

Patents granted per year, 2013 to 2024Bar chart with a peak of 9 patents in 2015.peak 92013: 2 patents20132014: 2 patents2015: 9 patents20152016: 9 patents2017: 7 patents20172018: 8 patents2019: 7 patents20192020: 3 patents2021: 8 patents20212022: 4 patents2023: 5 patents20232024: 4 patents2024

Issued Patents All Time

Showing 1–25 of 70 patents

Patent #TitleCo-InventorsDate
12467850 Device and method for measuring a substrate Jacek Gasiorowski 2025-11-11
12456720 Method for bonding of chips — 2025-10-28
12135500 Stamp and method for embossing Gerald Mittendorfer 2024-11-05
12107057 Method for permanent connection of two metal surfaces Viorel Dragoi 2024-10-01
11990463 Device for bonding chips — 2024-05-21
11862487 Device and method for bonding of two substrates Florian Kurz, Viorel Dragoi 2024-01-02
11776842 Method and device for surface treatment of substrates — 2023-10-03
11764198 Method and device for bonding of chips — 2023-09-19
11756818 Accommodating device for retaining wafers Thomas Wagenleitner, Alexander Filbert 2023-09-12
11697281 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2023-07-11
11562912 Device and method for bonding of two substrates Florian Kurz, Viorel Dragoi 2023-01-24
11355374 Accommodating device for retaining wafers Thomas Wagenleitner, Alexander Filbert 2022-06-07
11348825 Method and device for surface treatment of substrates — 2022-05-31
11282801 Method for permanent connection of two metal surfaces Viorel Dragoi 2022-03-22
11276589 Device and method for bonding of two substrates Florian Kurz, Viorel Dragoi 2022-03-15
11139170 Apparatus and method for bonding substrates Viorel Dragoi, Christoph Flotgen 2021-10-05
11059280 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2021-07-13
11020950 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2021-06-01
11020953 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2021-06-01
11020952 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2021-06-01
11020951 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2021-06-01
10964562 Device and method for bonding of two substrates Florian Kurz, Viorel Dragoi 2021-03-30
10886156 Accomodating device for retaining wafers Thomas Wagenleitner, Alexander Filbert 2021-01-05
10825793 Method for permanently bonding wafers Thomas Plach, Kurt Hingerl, Christoph Flotgen 2020-11-03
10796944 Method and device for surface treatment of substrates — 2020-10-06

Frequent Collaborators

Thomas Wagenleitner12 shared
Friedrich Paul Lindner12 shared
Thomas Plach12 shared
Florian Kurz11 shared
Viorel Dragoi10 shared
Christoph Flotgen8 shared

Nearby-Ranked Inventors

Stefan Illek70
Soutsada Vongseng70
Takashi Ohtsuka70
Yong Yu70
Ryan Schaub70
Zhihong Liu70
Angel Fernando Porras70
Hao A. Chen70
Hiroshi Terada70