Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
MW

Markus Wimplinger — 68 Patents

EGEv Group E. Thallner Gmbh: 59 patents #1 of 65Top 2%
EGEv Group Gmbh: 9 patents #3 of 16Top 20%
Ried im Innkreis, AT: #1 of 149 inventorsTop 1%
Overall (All Time): #30,886 of 4,157,543Top 1%
68 Patents All Time

Issued Patents All Time

Showing 26–50 of 68 patents

Patent #TitleCo-InventorsDate
10438798 Apparatus and method for bonding substrates Viorel Dragoi, Christoph Flotgen 2019-10-08
10438925 Method for applying a bonding layer 2019-10-08
10325798 Accommodating device for retaining wafers Thomas Wagenleitner, Alexander Filbert 2019-06-18
10279551 Method for producing a microlens Erich Thallner, Michael Kast 2019-05-07
10279575 Device and method for bonding substrates Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz 2019-05-07
10239253 Method for embossing of substrates Friedrich Paul Lindner, Thomas Glinsner 2019-03-26
10163681 Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation Klaus Martinschitz, Bernhard Rebhan, Kurt Hingerl 2018-12-25
10109538 Measuring device and method for measuring layer thicknesses and defects in a wafer stack 2018-10-23
10083854 Method and device for surface treatment of substrates 2018-09-25
10083933 Method for permanent bonding of wafers Thomas Plach, Kurt Hingerl, Christoph Flotgen 2018-09-25
10008424 Measuring device and method for measuring layer thicknesses and defects in a wafer stack 2018-06-26
9947638 Device and method for permanent bonding Bernhard Rebhan 2018-04-17
9911713 Method for applying a bonding layer 2018-03-06
9899223 Apparatus and method for bonding substrates including changing a stoichiometry of oxide layers formed on the substrates Viorel Dragoi, Christoph Flotgen 2018-02-20
9806054 Flexible substrate holder, device and method for detaching a first substrate Jurgen Burggraf, Gerald Mittendorfer 2017-10-31
9764511 Nanostructure die, embossing roll, device and method for continuous embossing of nanostructures Gerald Kreindl, Thomas Glinsner 2017-09-19
9738042 Die tool, device and method for producing a lens wafer Michael Kast 2017-08-22
9673167 Method for bonding substrates 2017-06-06
9662846 Method and device for producing a lens wafer Michael Kast 2017-05-30
9643366 Method and device for producing a lens wafer Michael Kast 2017-05-09
9627349 Method for applying a bonding layer 2017-04-18
9500541 Method and device for determining the pressure distribution for bonding Bernhard Rebhan, Jurgen Burggraf 2016-11-22
9478518 Method for permanent connection of two metal surfaces Viorel Dragoi 2016-10-25
9358765 Method for coating and bonding substrates Bernhard Rebhan 2016-06-07
9362154 Method for treatment of a temporarily bonded product wafer Jurgen Burggraf, Harald Wiesbauer 2016-06-07