Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024530 | Method for the bonding and debonding of substrates | Jurgen Burggraf | 2021-06-01 |
| 10468286 | Method for the bonding and debonding of substrates | Jurgen Burggraf | 2019-11-05 |
| 9362154 | Method for treatment of a temporarily bonded product wafer | Jurgen Burggraf, Markus Wimplinger | 2016-06-07 |
| 9245869 | Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements | Jurgen Burggraf, Markus Wimplinger, Alfred Sigl | 2016-01-26 |
| 9224630 | Method for producing a wafer provided with chips | Jurgen Burggraf, Markus Wimplinger | 2015-12-29 |