Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12103787 | Method and device for transferring components | — | 2024-10-01 |
| 12087726 | Device and method for joining substrates | — | 2024-09-10 |
| 11024530 | Method for the bonding and debonding of substrates | Harald Wiesbauer | 2021-06-01 |
| 10943810 | Device and method for bonding | — | 2021-03-09 |
| 10497601 | Device and method for coating of a carrier wafer | — | 2019-12-03 |
| 10468286 | Method for the bonding and debonding of substrates | Harald Wiesbauer | 2019-11-05 |
| 10272660 | Bendable carrier mount, device and method for releasing a carrier substrate | Daniel Burgstaller | 2019-04-30 |
| 9984942 | Method and device for leveling a substrate stack | Friedrich Paul Lindner | 2018-05-29 |
| 9929124 | Method for bonding substrates | — | 2018-03-27 |
| 9806054 | Flexible substrate holder, device and method for detaching a first substrate | Markus Wimplinger, Gerald Mittendorfer | 2017-10-31 |
| 9500541 | Method and device for determining the pressure distribution for bonding | Bernhard Rebhan, Markus Wimplinger | 2016-11-22 |
| 9457552 | Method for detaching a product substrate off a carrier substrate | Friedrich Paul Lindner | 2016-10-04 |
| 9449863 | Device for aligning and pre-fixing a wafer | Friedrich Paul Lindner, Stefan Pargfrieder, Daniel Burgstaller | 2016-09-20 |
| 9390956 | Method for the temporary connection of a product substrate to a carrier substrate | Gerald Mittendorfer | 2016-07-12 |
| 9381729 | Device for detaching a product substrate off a carrier substrate | Friedrich Paul Lindner | 2016-07-05 |
| 9381732 | Device for stripping a product substrate from a carrier substrate | Friedrich Paul Lindner | 2016-07-05 |
| 9362154 | Method for treatment of a temporarily bonded product wafer | Harald Wiesbauer, Markus Wimplinger | 2016-06-07 |
| 9296193 | Bendable carrier mount, device and method for releasing a carrier substrate | Daniel Burgstaller | 2016-03-29 |
| 9278433 | Receiving device for receiving semiconductor substrates | Herbert Tiefenböck, Stefan Pargfrieder, Daniel Burgstaller | 2016-03-08 |
| 9272501 | Device for detaching a product substrate off a carrier substrate | Friedrich Paul Lindner | 2016-03-01 |
| 9245869 | Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements | Markus Wimplinger, Harald Wiesbauer, Alfred Sigl | 2016-01-26 |
| 9224630 | Method for producing a wafer provided with chips | Markus Wimplinger, Harald Wiesbauer | 2015-12-29 |
| 9186877 | Method for stripping a product substrate from a carrier substrate | Friedrich Paul Lindner | 2015-11-17 |
| 8986496 | Device and method for stripping a product substrate from a carrier substrate | Friedrich Paul Lindner | 2015-03-24 |
| 8918989 | Device for aligning and pre-fixing a wafer | Friedrich Paul Lindner, Stefan Pargfrieder, Daniel Burgstaller | 2014-12-30 |