Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163681 | Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation | Markus Wimplinger, Bernhard Rebhan, Kurt Hingerl | 2018-12-25 |
| 9067363 | Method and device for permanent bonding of wafers, as well as cutting tool | Markus Wimplinger, Bernhard Rebhan | 2015-06-30 |