Issued Patents All Time
Showing 1–25 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12312512 | Adhesive sheet for backgrinding and production method for semiconductor wafer | Tomoya Tsukui, Tomoyuki Kanai, Takeshi Saito | 2025-05-27 |
| 12243766 | Back grinding adhesive sheet, and method for manufacturing semiconductor wafer | Tomoya Tsukui, Tomoyuki Kanai, Takeshi Saito | 2025-03-04 |
| 12224207 | Method of processing a workpiece and system for processing a workpiece | Hitoshi Hoshino, Tzanimir Arguirov, Yasuyoshi Yubira | 2025-02-11 |
| 12211723 | Alignment device and alignment method | Yoshiyuki Harioka, Ken Ikehata, Yoshinori KAKINUMA, Yosuke Ishimatsu, Ryouta Sawayama | 2025-01-28 |
| 12094751 | Method of processing a substrate | — | 2024-09-17 |
| 12062533 | Method of producing a substrate and system for producing a substrate | — | 2024-08-13 |
| 11935768 | Device and method for attaching protective tape on semiconductor wafer | Ken Ikehata, Yoshinori KAKINUMA, Yosuke Ishimatsu | 2024-03-19 |
| 11894271 | Method of processing wafer | Hideyuki Sandoh | 2024-02-06 |
| 11823941 | Method of processing a substrate | — | 2023-11-21 |
| 11784138 | Wafer processing with a protective film and peripheral adhesive | — | 2023-10-10 |
| 11676833 | Protective sheet for use in processing wafer, handling system for wafer, and combination of wafer and protective sheeting | — | 2023-06-13 |
| 11637074 | Method of processing wafer | — | 2023-04-25 |
| 11626324 | Method of processing a wafer | Hitoshi Hoshino, Dietmar Mayer | 2023-04-11 |
| 11559974 | Microfluidic system or device and method of manufacturing a microfluidic system or device | Devin Martin | 2023-01-24 |
| 11469120 | Device and method for attaching protective tape to semiconductor wafer | Yoshinori KAKINUMA, Yosuke Ishimatsu, Ken Ikehata | 2022-10-11 |
| 11437275 | Method of processing wafer and protective sheeting for use in this method | — | 2022-09-06 |
| 11424161 | Substrate processing method | Tzanimir Arguirov, Yasuyoshi Yubira | 2022-08-23 |
| 11201126 | Method of producing a substrate and system for producing a substrate | Hitoshi Hoshino | 2021-12-14 |
| 11133219 | Method of processing a wafer | Hitoshi Hoshino, Dietmar Mayer | 2021-09-28 |
| 11011406 | Method of processing a substrate | Kensuke Nagaoka | 2021-05-18 |
| 10991612 | Method of processing wafer having protrusions on the back side | — | 2021-04-27 |
| 10991623 | Wafer processing method | Masatoshi WAKAHARA, Meiya Piao, Kentaro Odanaka, Wakana Onoe, Heidi Lan | 2021-04-27 |
| 10784164 | Method of dividing wafer | — | 2020-09-22 |
| 10727128 | Method of processing a wafer | Roland Zimmermann, Hitoshi Hoshino | 2020-07-28 |
| 10727127 | Method of processing a substrate | Hiroshi Morikazu, Nao Hattori | 2020-07-28 |