Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727127 | Method of processing a substrate | Hiroshi Morikazu, Karl Heinz Priewasser | 2020-07-28 |
| 10702946 | Substrate processing method | Hiroshi Morikazu, Karl Heinz Priewasser | 2020-07-07 |
| 10580697 | Workpiece dividing method | — | 2020-03-03 |
| 10535565 | Workpiece dividing method | — | 2020-01-14 |
| 9831128 | Method of processing a substrate | Hiroshi Morikazu, Karl Heinz Priewasser | 2017-11-28 |
| 9721809 | Method of forming gettering layer | Hiroshi Morikazu | 2017-08-01 |
| 9576835 | Workpiece processing method | Frank Wei, Hiroshi Morikazu | 2017-02-21 |