Hiroshi Morikazu — 95 Patents at Disco

Hiroshi Morikazu has been granted 95 US patents while listed as an inventor at Disco. The first was granted in 2008 and the most recent in July 2025. Hiroshi Morikazu ranks #16,077 of 4,157,543 US inventors in our database (top 0.39%). Patent records list Hiroshi Morikazu in Tokyo, JP.

Issued Patents All Time

Showing 1–25 of 95 patents

Patent #	Title	Co-Inventors	Date
12343812	Laser processing apparatus	Naotoshi Kirihara, Yohei Kaneko, Kentaro Odanaka	2025-07-01
12337412	Laser processing apparatus and laser processing method	Naotoshi Kirihara, Yohei Kaneko, Kentaro Odanaka	2025-06-24
12290881	Laser processing method	—	2025-05-06
12151312	Laser processing apparatus	Nobuyuki Kimura	2024-11-26
11933667	Inspection apparatus and inspection method	—	2024-03-19
11654511	Laser processing apparatus	—	2023-05-23
11597040	Laser processing apparatus	Noboru Takeda	2023-03-07
11211296	Comparing method and laser processing apparatus	Fumiya KAWANO, Tasuku Koyanagi	2021-12-28
11114341	Laser processing method	—	2021-09-07
10985060	Laser processing method using plasma light detection for forming a pore in a substrate	—	2021-04-20
10923873	Laser processing apparatus	—	2021-02-16
10910511	Manufacturing method of III-V compound crystal and manufacturing method of semiconductor device	Yusuke Mori, Masashi Yoshimura, Mamoru Imade, Masayuki Imanishi, Shin Tabata +1 more	2021-02-02
10903087	Laser processing method	—	2021-01-26
10886159	Method of processing wafer	Tasuku Koyanagi	2021-01-05
10780524	Laser processing method and laser processing apparatus	Noboru Takeda	2020-09-22
10727127	Method of processing a substrate	Karl Heinz Priewasser, Nao Hattori	2020-07-28
10702946	Substrate processing method	Karl Heinz Priewasser, Nao Hattori	2020-07-07
10628933	Inspecting apparatus and laser processing apparatus	Noboru Takeda	2020-04-21
10610974	Laser processing apparatus and laser processing method	Tomoki Yoshino	2020-04-07
10553490	Processing method for wafer	Noboru Takeda	2020-02-04
10483149	Wafer processing method for dividing a wafer, including a shield tunnel forming step	—	2019-11-19
10319593	Wafer thinning method	Kazuya Hirata, Yoko Nishino, Karl Heinz Priewasser	2019-06-11
10207369	Method for forming a laser processed hole	Keiji Nomaru	2019-02-19
10175204	Method of sorting chips	Kazuma Sekiya	2019-01-08
10157793	Method of processing single-crystal substrate	Noboru Takeda, Takumi Shotokuji	2018-12-18

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Hiroshi Morikazu — 95 Patents

Issued Patents All Time

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