Issued Patents All Time
Showing 25 most recent of 95 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12343812 | Laser processing apparatus | Naotoshi Kirihara, Yohei Kaneko, Kentaro Odanaka | 2025-07-01 |
| 12337412 | Laser processing apparatus and laser processing method | Naotoshi Kirihara, Yohei Kaneko, Kentaro Odanaka | 2025-06-24 |
| 12290881 | Laser processing method | — | 2025-05-06 |
| 12151312 | Laser processing apparatus | Nobuyuki Kimura | 2024-11-26 |
| 11933667 | Inspection apparatus and inspection method | — | 2024-03-19 |
| 11654511 | Laser processing apparatus | — | 2023-05-23 |
| 11597040 | Laser processing apparatus | Noboru Takeda | 2023-03-07 |
| 11211296 | Comparing method and laser processing apparatus | Fumiya KAWANO, Tasuku Koyanagi | 2021-12-28 |
| 11114341 | Laser processing method | — | 2021-09-07 |
| 10985060 | Laser processing method using plasma light detection for forming a pore in a substrate | — | 2021-04-20 |
| 10923873 | Laser processing apparatus | — | 2021-02-16 |
| 10910511 | Manufacturing method of III-V compound crystal and manufacturing method of semiconductor device | Yusuke Mori, Masashi Yoshimura, Mamoru Imade, Masayuki Imanishi, Shin Tabata +1 more | 2021-02-02 |
| 10903087 | Laser processing method | — | 2021-01-26 |
| 10886159 | Method of processing wafer | Tasuku Koyanagi | 2021-01-05 |
| 10780524 | Laser processing method and laser processing apparatus | Noboru Takeda | 2020-09-22 |
| 10727127 | Method of processing a substrate | Karl Heinz Priewasser, Nao Hattori | 2020-07-28 |
| 10702946 | Substrate processing method | Karl Heinz Priewasser, Nao Hattori | 2020-07-07 |
| 10628933 | Inspecting apparatus and laser processing apparatus | Noboru Takeda | 2020-04-21 |
| 10610974 | Laser processing apparatus and laser processing method | Tomoki Yoshino | 2020-04-07 |
| 10553490 | Processing method for wafer | Noboru Takeda | 2020-02-04 |
| 10483149 | Wafer processing method for dividing a wafer, including a shield tunnel forming step | — | 2019-11-19 |
| 10319593 | Wafer thinning method | Kazuya Hirata, Yoko Nishino, Karl Heinz Priewasser | 2019-06-11 |
| 10207369 | Method for forming a laser processed hole | Keiji Nomaru | 2019-02-19 |
| 10175204 | Method of sorting chips | Kazuma Sekiya | 2019-01-08 |
| 10157793 | Method of processing single-crystal substrate | Noboru Takeda, Takumi Shotokuji | 2018-12-18 |