Issued Patents All Time
Showing 26–50 of 95 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10119921 | Internal crack detecting method and internal crack detecting apparatus | Noboru Takeda | 2018-11-06 |
| 10103061 | Processing method of single-crystal substrate | Noboru Takeda, Takumi Shotokuji | 2018-10-16 |
| 10083849 | Method of processing wafer | — | 2018-09-25 |
| 10079179 | Wafer processing method | — | 2018-09-18 |
| 10071442 | Laser processing apparatus | Noboru Takeda, Kazuya Hirata | 2018-09-11 |
| 9941166 | Method of processing a substrate | — | 2018-04-10 |
| 9831128 | Method of processing a substrate | Karl Heinz Priewasser, Nao Hattori | 2017-11-28 |
| 9812362 | Wafer processing method | Noboru Takeda | 2017-11-07 |
| 9793166 | Lift-off method | Tasuku Koyanagi, Noboru Takeda | 2017-10-17 |
| 9735040 | Method of processing single-crystal substrate | Noboru Takeda, Takumi Shotokuji | 2017-08-15 |
| 9721809 | Method of forming gettering layer | Nao Hattori | 2017-08-01 |
| 9682440 | Chip manufacturing method | Noboru Takeda | 2017-06-20 |
| 9656347 | Laser processing method for forming a laser processed hole in a work piece | — | 2017-05-23 |
| 9613795 | Wafer processing method to remove crystal strains | Kenya Kai | 2017-04-04 |
| 9576835 | Workpiece processing method | Frank Wei, Nao Hattori | 2017-02-21 |
| 9543466 | Method for forming shield tunnels in single-crystal substrates | — | 2017-01-10 |
| 9537046 | Optical device wafer processing method | Noboru Takeda | 2017-01-03 |
| 9536786 | Wafer processing method using pulsed laser beam to form shield tunnels along division lines of a semiconductor wafer | Motohiko Shimada | 2017-01-03 |
| 9530929 | Lift-off method | Tasuku Koyanagi, Shin Tabata | 2016-12-27 |
| 9517962 | Plate-shaped object processing method | Noboru Takeda, Xiaoming Qiu, Fumiteru Tashino, Ken Togashi | 2016-12-13 |
| 9511579 | Separation apparatus | Tasuku Koyanagi, Shin Tabata | 2016-12-06 |
| 9425349 | Lift-off method | — | 2016-08-23 |
| 9349646 | Wafer processing method including a filament forming step and an etching step | Noboru Takeda | 2016-05-24 |
| 9305793 | Wafer processing method | Noboru Takeda | 2016-04-05 |
| 9289851 | Laser processing method | — | 2016-03-22 |