Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183635 | Wafer processing method and wafer processing apparatus | Kentaro Odanaka | 2024-12-31 |
| 11894823 | Saw device manufacturing method | — | 2024-02-06 |
| 11515210 | Wafer processing method and wafer processing apparatus | Kentaro Odanaka | 2022-11-29 |
| 11165408 | Method of manufacturing substrate for acoustic wave device | Jun Abatake, Kentaro Shiraga, Keiji Nomaru | 2021-11-02 |
| 9731402 | Grinding apparatus | — | 2017-08-15 |
| 9613795 | Wafer processing method to remove crystal strains | Hiroshi Morikazu | 2017-04-04 |