Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11165408 | Method of manufacturing substrate for acoustic wave device | Kenya Kai, Kentaro Shiraga, Keiji Nomaru | 2021-11-02 |
| 11088674 | Saw filter manufacturing method and saw filter | Keiji Nomaru | 2021-08-10 |
| 10050599 | BAW device and method of manufacturing BAW device | — | 2018-08-14 |
| 8642920 | Wafer dividing apparatus and laser processing apparatus | Chikara Aikawa, Yasuyoshi Yubira, Hiroto Yoshida | 2014-02-04 |
| 8415234 | Wafer dividing method | — | 2013-04-09 |