Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600527 | Lift-off method for transferring optical device layer | — | 2023-03-07 |
| 11552214 | Lift-off method and laser processing apparatus | Junya MIMURA | 2023-01-10 |
| 11211296 | Comparing method and laser processing apparatus | Fumiya KAWANO, Hiroshi Morikazu | 2021-12-28 |
| 11011670 | Optical device layer transferring method | — | 2021-05-18 |
| 10916679 | Optical device wafer processing method | — | 2021-02-09 |
| 10886159 | Method of processing wafer | Hiroshi Morikazu | 2021-01-05 |
| 10854774 | Lift-off method | Hiroki Takeuchi | 2020-12-01 |
| 10658220 | Device transferring method | Akihito Kawai | 2020-05-19 |
| 9793166 | Lift-off method | Noboru Takeda, Hiroshi Morikazu | 2017-10-17 |
| 9530929 | Lift-off method | Hiroshi Morikazu, Shin Tabata | 2016-12-27 |
| 9531154 | Lift-off method | — | 2016-12-27 |
| 9511579 | Separation apparatus | Hiroshi Morikazu, Shin Tabata | 2016-12-06 |
| 8178425 | Optical device wafer processing method | Hiroshi Morikazu | 2012-05-15 |
| 8148184 | Optical device wafer processing method | Hiroshi Morikazu | 2012-04-03 |