AK

Akihito Kawai

DI Disco: 14 patents #41 of 708Top 6%
Overall (All Time): #329,952 of 4,157,543Top 8%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12383982 Laminated device wafer forming method Zhiwen Chen, Kyosuke Kobinata, Shunsuke Teranishi 2025-08-12
12322655 Method of manufacturing layered device chip assembly Shunsuke Teranishi, Zhiwen Chen, Kyosuke Kobinata 2025-06-03
12300545 Wafer manufacturing method and laminated device chip manufacturing method Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi 2025-05-13
12198990 Wafer manufacturing method and laminated device chip manufacturing method Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi 2025-01-14
11854891 Wafer manufacturing method and laminated device chip manufacturing method Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi 2023-12-26
11764115 Wafer manufacturing method and laminated device chip manufacturing method Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi 2023-09-19
11764114 Wafer manufacturing method and laminated device chip manufacturing method Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi 2023-09-19
11756831 Wafer manufacturing method and laminated device chip manufacturing method Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi 2023-09-12
11164802 Wafer manufacturing method and multilayer device chip manufacturing method Youngsuk Kim 2021-11-02
10658220 Device transferring method Tasuku Koyanagi 2020-05-19
8389386 Stacked wafer manufacturing method Koichi Kondo 2013-03-05
7687375 Lamination device manufacturing method Kazuhisa Arai 2010-03-30
7601485 Exposure method Kazuma Sekiya, Takashi Ono 2009-10-13
7129150 Method of dividing a semiconductor wafer 2006-10-31