| 9627241 |
Resin sheet attaching method |
— |
2017-04-18 |
| 9400423 |
Manufacturing method for photomask |
— |
2016-07-26 |
| 8673743 |
Wafer dividing method |
— |
2014-03-18 |
| 8142259 |
Grinding machine and method |
— |
2012-03-27 |
| 7816264 |
Wafer processing method |
Keiichi Kajiyama |
2010-10-19 |
| 7727810 |
Wafer dividing method |
Masatoshi Nanjo |
2010-06-01 |
| 7704769 |
Optical device manufacturing method |
— |
2010-04-27 |
| 7687375 |
Lamination device manufacturing method |
Akihito Kawai |
2010-03-30 |
| 7498239 |
Wafer processing method |
— |
2009-03-03 |
| 7278206 |
Method of preparing terminal board |
Hideyuki Sando |
2007-10-09 |
| 7222772 |
Flip chip bonder |
Takashi Mori, Hideyuki Sandoh, Shinichi Namioka |
2007-05-29 |
| 7183178 |
Method of manufacturing semiconductor wafer |
— |
2007-02-27 |
| 6927416 |
Wafer support plate |
Masatoshi Nanjo, Masahiko Kitamura, Shinichi Namioka, Koichi Yajima |
2005-08-09 |
| 6759274 |
Semiconductor chip pick-up method |
Toshiaki Takahashi, Kouichi Yajima |
2004-07-06 |
| 6702652 |
Method of grinding rear side of semiconductor wafer |
— |
2004-03-09 |
| 6676491 |
Semiconductor wafer dividing method |
Masaya Takeuchi, Hiromi Hayashi, Hideyuki Sando |
2004-01-13 |
| 6594890 |
Method of separating a plate-like workpiece held by adhesion on an elastic adsorption pad |
Toshiaki Takahashi, Kouichi Yajima |
2003-07-22 |
| 6527627 |
Semiconductor wafer grinding method |
— |
2003-03-04 |
| 6528864 |
Semiconductor wafer having regular or irregular chip pattern and dicing method for the same |
— |
2003-03-04 |
| 6500047 |
Semiconductor wafer cutting machine |
Masaya Takeuchi, Hideyuki Sando |
2002-12-31 |
| 6358132 |
Apparatus for grinding spherical objects |
Toru Takazawa |
2002-03-19 |