Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341068 | Method of manufacturing chips | — | 2025-06-24 |
| 11894271 | Method of processing wafer | Karl Heinz Priewasser | 2024-02-06 |
| 11628515 | Processing apparatus for processing workpiece | — | 2023-04-18 |
| 11495466 | Processing method of wafer | Minoru Suzuki | 2022-11-08 |
| 11056346 | Wafer processing method | Ichiro Yamahata, Tomotaka Tabuchi | 2021-07-06 |
| 10811458 | Method of processing wafer | Ryugo Oba, Yukinobu Ohura | 2020-10-20 |
| 10410923 | Method of processing wafer | — | 2019-09-10 |
| 10083867 | Method of processing a wafer | — | 2018-09-25 |
| 7222772 | Flip chip bonder | Kazuhisa Arai, Takashi Mori, Shinichi Namioka | 2007-05-29 |