Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12304027 | Grinding apparatus and use method of grinding apparatus | Yuannan Li, Kazuma Sekiya | 2025-05-20 |
| 11056346 | Wafer processing method | Hideyuki Sandoh, Ichiro Yamahata | 2021-07-06 |
| 10692721 | Wafer processing method for reforming protective film | Lynne Tseng | 2020-06-23 |
| 10468303 | Device chip manufacturing method | — | 2019-11-05 |
| 10354919 | Wafer dividing method | Kentaro Odanaka, Satoshi Kumazawa, Senichi Ryo, Yuki Ogawa | 2019-07-16 |
| 10115636 | Processing method for workpiece | Yoshiteru Nishida, Hiroyuki Takahashi, Susumu Yokoo, Kenji Okazaki | 2018-10-30 |
| 9330976 | Wafer processing method | Susumu Yakoo, Hiroyuki Takahashi, Kenji Okazaki, Yoshiteru Nishida | 2016-05-03 |
| 9123797 | Resin powder wafer processing utilizing a frame with a plurality of partitions | Kazuma Sekiya | 2015-09-01 |
| 9112019 | Wafer processing utilizing a frame with a plurality of partitions | Kazuma Sekiya | 2015-08-18 |
| 6852608 | Production method for semiconductor chip | Masahiko Kitamura, Koichi Yajima, Yusuke Kimura | 2005-02-08 |