Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12121993 | Method of processing workpiece and laser processing apparatus | Masatoshi Nayuki, Keisuke NISHIMOTO | 2024-10-22 |
| 11577339 | Optical axis adjusting method for laser processing apparatus | Masatoshi Nayuki | 2023-02-14 |
| 11373907 | Method of manufacturing device chip | — | 2022-06-28 |
| 10796926 | Method of manufacturing glass interposer | Tsubasa Obata | 2020-10-06 |
| 10679897 | Device wafer processing method | Koichi Shigematsu | 2020-06-09 |
| 10354919 | Wafer dividing method | Tomotaka Tabuchi, Kentaro Odanaka, Senichi Ryo, Yuki Ogawa | 2019-07-16 |
| 10177004 | Method of processing wafer | Yoshio Watanabe, Siry Milan, Kenji Okazaki, Hiroyuki Takahashi, Yoshiteru Nishida | 2019-01-08 |
| 9649775 | Workpiece dividing method | — | 2017-05-16 |