Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12296407 | Laser processing apparatus | — | 2025-05-13 |
| 10985065 | Method of dicing a wafer by pre-sawing and subsequent laser cutting | Yohei Yamashita, Yuki Ogawa | 2021-04-20 |
| 10861712 | Workpiece processing method | — | 2020-12-08 |
| 10840140 | Backside wafer dividing method using water-soluble protective film | — | 2020-11-17 |
| 10796926 | Method of manufacturing glass interposer | Satoshi Kumazawa | 2020-10-06 |
| 10049934 | Wafer processing method | Yohei Yamashita, Yuki Ogawa | 2018-08-14 |
| 9953871 | Wafer processing method | Yohei Yamashita | 2018-04-24 |
| 9779993 | Wafer processing method including attaching a protective tape to a front side of a functional layer to prevent debris adhesion | Yuki Ogawa, Kensuke Nagaoka, Yuri Ban | 2017-10-03 |
| 9716039 | Wafer processing method | Yuki Ogawa, Kensuke Nagaoka, Yuri Ban | 2017-07-25 |
| 9698301 | Wafer processing method | Yuki Ogawa, Yohei Yamashita | 2017-07-04 |
| 9536787 | Wafer processing method | Yuki Ogawa, Kensuke Nagaoka, Yuri Ban | 2017-01-03 |
| 9455149 | Plate-like object processing method | Yuki Ogawa, Yuki Ishida | 2016-09-27 |
| 9293372 | Wafer processing method | Kensuke Nagaoka, Yuki Ogawa, Yuri Ban | 2016-03-22 |