Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818554 | Laser processing method of wafer using plural laser beams | — | 2020-10-27 |
| 10807198 | Laser processing apparatus | Yuta Yoshida, Kentaro Odanaka | 2020-10-20 |
| 10460991 | Resin package substrate processing method | — | 2019-10-29 |
| 9779993 | Wafer processing method including attaching a protective tape to a front side of a functional layer to prevent debris adhesion | Yuki Ogawa, Kensuke Nagaoka, Tsubasa Obata | 2017-10-03 |
| 9716039 | Wafer processing method | Yuki Ogawa, Kensuke Nagaoka, Tsubasa Obata | 2017-07-25 |
| 9536787 | Wafer processing method | Yuki Ogawa, Kensuke Nagaoka, Tsubasa Obata | 2017-01-03 |
| 9293372 | Wafer processing method | Kensuke Nagaoka, Yuki Ogawa, Tsubasa Obata | 2016-03-22 |