Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094776 | Wafer processing method | Hiroyuki Takahashi, Kentaro WADA, Yoshio Watanabe, Kenji Okazaki, Yoshiteru Nishida | 2024-09-17 |
| 11171009 | Processing method of wafer | Hiroyuki Takahashi, Kentaro WADA, Yoshio Watanabe | 2021-11-09 |
| 10896836 | Electrostatic chuck | Kenta Chito, Hidekazu Iida, Tomohiro Yamada, Yoshiteru Nishida, Hiroyuki Takahashi +1 more | 2021-01-19 |
| 10790192 | Wafer processing method | Yoshiteru Nishida, Hidekazu Iida, Hiroyuki Takahashi, Kenta Chito | 2020-09-29 |
| 10790193 | Wafer processing method | Yoshiteru Nishida, Hidekazu Iida, Hiroyuki Takahashi, Kenta Chito | 2020-09-29 |
| 10115636 | Processing method for workpiece | Yoshiteru Nishida, Tomotaka Tabuchi, Hiroyuki Takahashi, Kenji Okazaki | 2018-10-30 |