Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456213 | Processing method of wafer | Yoshiteru Nishida, Hidekazu Iida | 2022-09-27 |
| 10957593 | Method of processing a wafer | Yoshiteru Nishida, Hidekazu Iida, Youngsuk Kim | 2021-03-23 |
| 10910246 | Hold checking method and unhold checking method for wafer | — | 2021-02-02 |
| 10896836 | Electrostatic chuck | Hidekazu Iida, Tomohiro Yamada, Yoshiteru Nishida, Hiroyuki Takahashi, Ryoko Fujiya +1 more | 2021-01-19 |
| 10790193 | Wafer processing method | Yoshiteru Nishida, Hidekazu Iida, Susumu Yokoo, Hiroyuki Takahashi | 2020-09-29 |
| 10790192 | Wafer processing method | Yoshiteru Nishida, Hidekazu Iida, Susumu Yokoo, Hiroyuki Takahashi | 2020-09-29 |
| 10665492 | Wafer unloading method | — | 2020-05-26 |
| 10453719 | Plasma etching method | — | 2019-10-22 |