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USPTO Patent Rankings Data through Dec 31, 2025
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Youngsuk Kim — 56 Patents

DIDisco: 33 patents #17 of 708Top 3%
LG: 22 patents #1,933 of 26,165Top 8%
KTKt: 1 patents #406 of 904Top 45%
Tokyo, JP: #1,549 of 90,295 inventorsTop 2%
Overall (All Time): #44,020 of 4,157,543Top 2%
56 Patents All Time
Youngsuk Kim has been granted 56 US patents while listed as an inventor at Disco. The first was granted in 2014 and the most recent in May 2025. Youngsuk Kim ranks #44,020 of 4,157,543 US inventors in our database (top 1.1%). Patent records list Youngsuk Kim in Tokyo, JP.

Issued Patents All Time

Showing 1–25 of 56 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12317653 Method of manufacturing LED display panel Zhiwen Chen 2025-05-27
12300545 Wafer manufacturing method and laminated device chip manufacturing method Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi 2025-05-13
12288682 Processing method of wafer — 2025-04-29
12198990 Wafer manufacturing method and laminated device chip manufacturing method Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi 2025-01-14
12104057 Curable composition and optical material comprising cured product thereof Hee Jung Choi, Yeongrae Chang, Heon Kim, Hye Min Kim, Jaeyoung Kim +1 more 2024-10-01
12065544 Curable composition and optical element comprising cured product thereof Hee Jung Choi, Soonhwa JUNG, Yeongrae Chang, Hye Min Kim 2024-08-20
11935863 Laser reflow apparatus and laser reflow method Satoshi Kobayashi, Nobuyuki Kimura, Yuki IKKU, Zhiwen Chen 2024-03-19
11854891 Wafer manufacturing method and laminated device chip manufacturing method Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi 2023-12-26
11764115 Wafer manufacturing method and laminated device chip manufacturing method Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi 2023-09-19
11764114 Wafer manufacturing method and laminated device chip manufacturing method Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi 2023-09-19
11756831 Wafer manufacturing method and laminated device chip manufacturing method Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi 2023-09-12
11682569 Workpiece cutting method Byeongdeck Jang 2023-06-20
11607771 Wafer processing apparatus — 2023-03-21
11590629 Method of processing workpiece and resin sheet unit Yosuke Murata, Kazuhiro Koike, Byeongdeck Jang, Takeshi Sakamoto 2023-02-28
11576314 Plant cultivating apparatus Mina Yang 2023-02-14 $15,000
11528858 Plant cultivating apparatus Dongjin Lee 2022-12-20 $17,000
11508607 Method of processing workpiece and resin sheet unit Yosuke Murata, Kazuhiro Koike, Byeongdeck Jang, Takeshi Sakamoto 2022-11-22
11322476 Manufacturing method of producing shielded individual semiconductor packages Byeongdeck Jang 2022-05-03
11289348 Workpiece processing method Byeongdeck Jang 2022-03-29
11183464 Package substrate processing method and protective tape Byeongdeck Jang 2021-11-23
11164802 Wafer manufacturing method and multilayer device chip manufacturing method Akihito Kawai 2021-11-02
11133198 Method of manufacturing packaged device chip Byeongdeck Jang 2021-09-28
11114385 Plate-shaped workpiece processing method Byeongdeck Jang 2021-09-07
10957593 Method of processing a wafer Yoshiteru Nishida, Hidekazu Iida, Kenta Chito 2021-03-23
10957542 Method of processing wafer — 2021-03-23

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Ivan-Christophe Robin56
Gerard Zuber56
Yusuke Hashii56
Yoshito Suzuki56