Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12317653 | Method of manufacturing LED display panel | Zhiwen Chen | 2025-05-27 |
| 12300545 | Wafer manufacturing method and laminated device chip manufacturing method | Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi | 2025-05-13 |
| 12288682 | Processing method of wafer | — | 2025-04-29 |
| 12198990 | Wafer manufacturing method and laminated device chip manufacturing method | Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi | 2025-01-14 |
| 12104057 | Curable composition and optical material comprising cured product thereof | Hee Jung Choi, Yeongrae Chang, Heon Kim, Hye Min Kim, Jaeyoung Kim +1 more | 2024-10-01 |
| 12065544 | Curable composition and optical element comprising cured product thereof | Hee Jung Choi, Soonhwa JUNG, Yeongrae Chang, Hye Min Kim | 2024-08-20 |
| 11935863 | Laser reflow apparatus and laser reflow method | Satoshi Kobayashi, Nobuyuki Kimura, Yuki IKKU, Zhiwen Chen | 2024-03-19 |
| 11854891 | Wafer manufacturing method and laminated device chip manufacturing method | Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi | 2023-12-26 |
| 11764115 | Wafer manufacturing method and laminated device chip manufacturing method | Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi | 2023-09-19 |
| 11764114 | Wafer manufacturing method and laminated device chip manufacturing method | Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi | 2023-09-19 |
| 11756831 | Wafer manufacturing method and laminated device chip manufacturing method | Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi | 2023-09-12 |
| 11682569 | Workpiece cutting method | Byeongdeck Jang | 2023-06-20 |
| 11607771 | Wafer processing apparatus | — | 2023-03-21 |
| 11590629 | Method of processing workpiece and resin sheet unit | Yosuke Murata, Kazuhiro Koike, Byeongdeck Jang, Takeshi Sakamoto | 2023-02-28 |
| 11576314 | Plant cultivating apparatus | Mina Yang | 2023-02-14 |
| 11528858 | Plant cultivating apparatus | Dongjin Lee | 2022-12-20 |
| 11508607 | Method of processing workpiece and resin sheet unit | Yosuke Murata, Kazuhiro Koike, Byeongdeck Jang, Takeshi Sakamoto | 2022-11-22 |
| 11322476 | Manufacturing method of producing shielded individual semiconductor packages | Byeongdeck Jang | 2022-05-03 |
| 11289348 | Workpiece processing method | Byeongdeck Jang | 2022-03-29 |
| 11183464 | Package substrate processing method and protective tape | Byeongdeck Jang | 2021-11-23 |
| 11164802 | Wafer manufacturing method and multilayer device chip manufacturing method | Akihito Kawai | 2021-11-02 |
| 11133198 | Method of manufacturing packaged device chip | Byeongdeck Jang | 2021-09-28 |
| 11114385 | Plate-shaped workpiece processing method | Byeongdeck Jang | 2021-09-07 |
| 10957593 | Method of processing a wafer | Yoshiteru Nishida, Hidekazu Iida, Kenta Chito | 2021-03-23 |
| 10957542 | Method of processing wafer | — | 2021-03-23 |