Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300545 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2025-05-13 |
| 12198990 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2025-01-14 |
| 11854891 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2023-12-26 |
| 11764114 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2023-09-19 |
| 11764115 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2023-09-19 |
| 11756831 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2023-09-12 |
| 11682569 | Workpiece cutting method | Youngsuk Kim | 2023-06-20 |
| 11590629 | Method of processing workpiece and resin sheet unit | Yosuke Murata, Kazuhiro Koike, Youngsuk Kim, Takeshi Sakamoto | 2023-02-28 |
| 11508607 | Method of processing workpiece and resin sheet unit | Yosuke Murata, Kazuhiro Koike, Youngsuk Kim, Takeshi Sakamoto | 2022-11-22 |
| 11322476 | Manufacturing method of producing shielded individual semiconductor packages | Youngsuk Kim | 2022-05-03 |
| 11289348 | Workpiece processing method | Youngsuk Kim | 2022-03-29 |
| 11183464 | Package substrate processing method and protective tape | Youngsuk Kim | 2021-11-23 |
| 11133198 | Method of manufacturing packaged device chip | Youngsuk Kim | 2021-09-28 |
| 11114385 | Plate-shaped workpiece processing method | Youngsuk Kim | 2021-09-07 |
| 10937668 | Semiconductor package manufacturing method | Youngsuk Kim | 2021-03-02 |
| 10861716 | Processing method for package substrate | Youngsuk Kim | 2020-12-08 |
| 10515841 | Method for dividing substrate along division lines using abrasive member having projection for cutting substrate | Youngsuk Kim | 2019-12-24 |
| 10497623 | Method of manufacturing a semiconductor package including a shield layer | Youngsuk Kim | 2019-12-03 |
| 10431555 | Method of manufacturing semiconductor package | Youngsuk Kim | 2019-10-01 |
| 10403520 | Multi-blade and processing method of workpiece | Youngsuk Kim, Takahiro Ishii, Maki Sakai | 2019-09-03 |
| 10366907 | Manufacturing method of semiconductor package | Youngsuk Kim | 2019-07-30 |
| 10211164 | Semiconductor package manufacturing method | Youngsuk Kim, Fumio Uchida | 2019-02-19 |