Byeongdeck Jang — 22 Patents at Disco

Byeongdeck Jang has been granted 22 US patents while listed as an inventor at Disco. The first was granted in 2019 and the most recent in May 2025. Byeongdeck Jang ranks #189,202 of 4,157,543 US inventors in our database (top 4.6%). Patent records list Byeongdeck Jang in Tokyo, JP.

Issued Patents All Time

Showing 1–22 of 22 patents

Patent #	Title	Co-Inventors	Date
12300545	Wafer manufacturing method and laminated device chip manufacturing method	Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi	2025-05-13
12198990	Wafer manufacturing method and laminated device chip manufacturing method	Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi	2025-01-14
11854891	Wafer manufacturing method and laminated device chip manufacturing method	Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi	2023-12-26
11764114	Wafer manufacturing method and laminated device chip manufacturing method	Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi	2023-09-19
11764115	Wafer manufacturing method and laminated device chip manufacturing method	Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi	2023-09-19
11756831	Wafer manufacturing method and laminated device chip manufacturing method	Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi	2023-09-12
11682569	Workpiece cutting method	Youngsuk Kim	2023-06-20
11590629	Method of processing workpiece and resin sheet unit	Yosuke Murata, Kazuhiro Koike, Youngsuk Kim, Takeshi Sakamoto	2023-02-28
11508607	Method of processing workpiece and resin sheet unit	Yosuke Murata, Kazuhiro Koike, Youngsuk Kim, Takeshi Sakamoto	2022-11-22
11322476	Manufacturing method of producing shielded individual semiconductor packages	Youngsuk Kim	2022-05-03
11289348	Workpiece processing method	Youngsuk Kim	2022-03-29
11183464	Package substrate processing method and protective tape	Youngsuk Kim	2021-11-23
11133198	Method of manufacturing packaged device chip	Youngsuk Kim	2021-09-28
11114385	Plate-shaped workpiece processing method	Youngsuk Kim	2021-09-07
10937668	Semiconductor package manufacturing method	Youngsuk Kim	2021-03-02
10861716	Processing method for package substrate	Youngsuk Kim	2020-12-08
10515841	Method for dividing substrate along division lines using abrasive member having projection for cutting substrate	Youngsuk Kim	2019-12-24
10497623	Method of manufacturing a semiconductor package including a shield layer	Youngsuk Kim	2019-12-03
10431555	Method of manufacturing semiconductor package	Youngsuk Kim	2019-10-01
10403520	Multi-blade and processing method of workpiece	Youngsuk Kim, Takahiro Ishii, Maki Sakai	2019-09-03
10366907	Manufacturing method of semiconductor package	Youngsuk Kim	2019-07-30
10211164	Semiconductor package manufacturing method	Youngsuk Kim, Fumio Uchida	2019-02-19

Byeongdeck Jang — 22 Patents

Issued Patents All Time

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