Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8415232 | Dividing method for wafer having die bonding film attached to the back side thereof | Takatoshi Masuda | 2013-04-09 |
| 8268656 | Optical device wafer processing method | — | 2012-09-18 |
| 8025556 | Method of grinding wafer | Takatoshi Masuda, Shinya Watanabe, Setsuo Yamamoto | 2011-09-27 |
| 7858530 | Processing method for wafer and processing apparatus therefor | Takatoshi Masuda | 2010-12-28 |
| 7858496 | Wafer processing method | Azumi Kondo | 2010-12-28 |
| 7816264 | Wafer processing method | Kazuhisa Arai | 2010-10-19 |
| 7718511 | Processing method for wafer | Takatoshi Masuda | 2010-05-18 |
| 7677955 | Grinding method for wafer | Takatoshi Masuda, Shinya Watanabe, Shigehiko Aoki, Hirotoshi Hoshikawa, Yoshikazu Kobayashi +2 more | 2010-03-16 |
| 7629230 | Wafer processing method | Kazuma Sekiya | 2009-12-08 |
| 7625810 | Wafer processing method | Koichi Kondo, Yasuomi Kaneuchi | 2009-12-01 |
| 7527547 | Wafer processing method | Tadato Nagasawa | 2009-05-05 |
| 6939785 | Process for manufacturing a semiconductor chip | Kentaro Odanaka | 2005-09-06 |
| 6306274 | Method for making electrodeposition blades | — | 2001-10-23 |
| 6171176 | Method of effecting a precision saw-toothed grinding on the surface of a given workpiece | Kazuma Sekiya | 2001-01-09 |
| 4547998 | Electrodeposited grinding tool | — | 1985-10-22 |