| 8415232 |
Dividing method for wafer having die bonding film attached to the back side thereof |
Takatoshi Masuda |
2013-04-09 |
| 8268656 |
Optical device wafer processing method |
— |
2012-09-18 |
| 8025556 |
Method of grinding wafer |
Takatoshi Masuda, Shinya Watanabe, Setsuo Yamamoto |
2011-09-27 |
| 7858530 |
Processing method for wafer and processing apparatus therefor |
Takatoshi Masuda |
2010-12-28 |
| 7858496 |
Wafer processing method |
Azumi Kondo |
2010-12-28 |
| 7816264 |
Wafer processing method |
Kazuhisa Arai |
2010-10-19 |
| 7718511 |
Processing method for wafer |
Takatoshi Masuda |
2010-05-18 |
| 7677955 |
Grinding method for wafer |
Takatoshi Masuda, Shinya Watanabe, Shigehiko Aoki, Hirotoshi Hoshikawa, Yoshikazu Kobayashi +2 more |
2010-03-16 |
| 7629230 |
Wafer processing method |
Kazuma Sekiya |
2009-12-08 |
| 7625810 |
Wafer processing method |
Koichi Kondo, Yasuomi Kaneuchi |
2009-12-01 |
| 7527547 |
Wafer processing method |
Tadato Nagasawa |
2009-05-05 |
| 6939785 |
Process for manufacturing a semiconductor chip |
Kentaro Odanaka |
2005-09-06 |
| 6306274 |
Method for making electrodeposition blades |
— |
2001-10-23 |
| 6171176 |
Method of effecting a precision saw-toothed grinding on the surface of a given workpiece |
Kazuma Sekiya |
2001-01-09 |
| 4547998 |
Electrodeposited grinding tool |
— |
1985-10-22 |