Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8101504 | Semiconductor chip fabrication method | — | 2012-01-24 |
| 7549560 | Wafer dividing method | Yusuke Nagai, Toshiyuki Tateishi | 2009-06-23 |
| 7527547 | Wafer processing method | Keiichi Kajiyama | 2009-05-05 |
| 7439162 | Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniform | Ryuji Norimoto, Takatoshi Masuda | 2008-10-21 |
| 7179724 | Wafer processing method | Yusuke Nagai | 2007-02-20 |