Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431496 | Device chip package manufacturing method | — | 2019-10-01 |
| 9935008 | Semiconductor device chip manufacturing method | — | 2018-04-03 |
| 8318518 | Light emitting device and manufacturing method thereof | Hitoshi Hoshino | 2012-11-27 |
| 7549560 | Wafer dividing method | Yusuke Nagai, Tadato Nagasawa | 2009-06-23 |
| 6498075 | Dicing method | Kouji Fujimoto | 2002-12-24 |
| 6448151 | Process for producing a large number of semiconductor chips from a semiconductor wafer | — | 2002-09-10 |