HH

Hitoshi Hoshino

DI Disco: 23 patents #23 of 708Top 4%
Canon: 4 patents #10,118 of 19,416Top 55%
NE Nec: 3 patents #4,195 of 14,502Top 30%
DE Denso: 3 patents #3,857 of 11,792Top 35%
NH Namiki Seimitsu Houseki: 2 patents #30 of 108Top 30%
TO Toyota: 1 patents #15,335 of 26,838Top 60%
Fujitsu Limited: 1 patents #14,843 of 24,456Top 65%
ME Mitsubishi Jidosha Engineering: 1 patents #75 of 277Top 30%
MM Mitsubishi Motors: 1 patents #856 of 1,823Top 50%
Overall (All Time): #87,823 of 4,157,543Top 3%
37
Patents All Time

Issued Patents All Time

Showing 25 most recent of 37 patents

Patent #TitleCo-InventorsDate
12249134 Visualization method, program for the same, visualization device, and discrimination device having the same Takayuki Ishiguro 2025-03-11
12224207 Method of processing a workpiece and system for processing a workpiece Tzanimir Arguirov, Yasuyoshi Yubira, Karl Heinz Priewasser 2025-02-11
11626324 Method of processing a wafer Karl Heinz Priewasser, Dietmar Mayer 2023-04-11
11201126 Method of producing a substrate and system for producing a substrate Karl Heinz Priewasser 2021-12-14
11133219 Method of processing a wafer Karl Heinz Priewasser, Dietmar Mayer 2021-09-28
10733962 Image generation device Yuji Kitamura, Soju Matsumoto 2020-08-04
10727128 Method of processing a wafer Karl Heinz Priewasser, Roland Zimmermann 2020-07-28
10682728 Method of processing a substrate Karl Heinz Priewasser, Kenji Furuta 2020-06-16
10650775 Display control device Kentaro Kajita, Toshinori Aoki, Takashi Yanatsubo, Norikatsu Mio 2020-05-12
10242913 Method of processing a wafer and wafer processing system Karl Heinz Priewasser 2019-03-26
10211076 Wafer processing method Toshio Tsuchiya 2019-02-19
9935010 Method of processing a wafer and wafer processing system Karl Heinz Priewasser 2018-04-03
9455229 Composite substrate manufacturing method, semiconductor element manufacturing method, composite substrate, and semiconductor element Hideo Aida, Natsuko Aota, Hidetoshi Takeda, Keiji Honjo, Mai Ogasawara 2016-09-27
9065032 Method for manufacturing light-emitting element, and light-emitting element Hideo Aida, Natsuko Aota, Hidetoshi Takeda, Keiji Honjo 2015-06-23
8946056 Splitting method for optical device wafer Hiroumi Ueno 2015-02-03
8673695 Sapphire wafer dividing method Takashi Okamura 2014-03-18
8518730 Sapphire wafer dividing method Hiroumi Ueno, Yuji Nitta, Takashi Okamura 2013-08-27
8497189 Processing method for wafer 2013-07-30
8318518 Light emitting device and manufacturing method thereof Toshiyuki Tateishi 2012-11-27
8048780 Method of processing optical device wafer Takashi Yamaguchi 2011-11-01
8049134 Laser processing machine Keiji Nomaru, Koji Yamaguchi 2011-11-01
8040536 Image data communication in image processing system Yoshinori Ito, Kiyoshi Tokashiki, Masahiro Takayanagi, Yuzo Harano, Yutaka Tokura 2011-10-18
8028367 Vehicle wiper apparatus Hiroaki Makihara, Masayuki Tajima, Tohru Akita, Toshiharu Kamiya 2011-10-04
7977215 Method of processing optical device wafer Takashi Yamaguchi 2011-07-12
7802237 Method, system and computer program product for generating program Yasuhiro Yamada 2010-09-21