KF

Kenji Furuta

DI Disco: 22 patents #24 of 708Top 4%
OC Olympus Optical Co.: 12 patents #242 of 2,334Top 15%
ND Nitto Denko: 11 patents #297 of 2,479Top 15%
AC Alps Electric Co.: 1 patents #1,191 of 2,177Top 55%
KC Kasai Kogyo Co.: 1 patents #45 of 121Top 40%
SM Shima Seiki Mfg.: 1 patents #58 of 140Top 45%
Overall (All Time): #58,141 of 4,157,543Top 2%
48
Patents All Time

Issued Patents All Time

Showing 25 most recent of 48 patents

Patent #TitleCo-InventorsDate
12074067 Wafer dividing method and dividing apparatus 2024-08-27
12062575 Wafer processing method 2024-08-13
11548096 Laser processing apparatus 2023-01-10
11434341 Resin sheet and adhesive-layer-having resin sheet Yusuke YAMANARI, Makoto Saito, Akira Hirao 2022-09-06
11195757 Wafer processing method 2021-12-07
11168236 Acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet Kenta JOZUKA, Naoaki HIGUCHI, Naohiro Kato, Yasushi Buzojima 2021-11-09
11149171 Thermally-conductive pressure-sensitive adhesive sheet Yoshio Terada 2021-10-19
10864598 Evaluation jig and evaluation method for height position detection unit of laser processing apparatus 2020-12-15
10815396 Thermally conductive pressure-sensitive adhesive sheet Tatsuya Suzuki, Hiroki Ieda, Akira Hirao 2020-10-27
10682728 Method of processing a substrate Karl Heinz Priewasser, Hitoshi Hoshino 2020-06-16
10647891 Pressure-sensitive adhesive sheet and magnetic disc device Akira Hirao, Tatsuya Suzuki 2020-05-12
10593353 Pressure-sensitive adhesive sheet and magnetic disc device Akira Hirao, Tatsuya Suzuki, Hiroki Ieda, Akira Chinen, Minami Watanabe 2020-03-17
10525668 Pressure-sensitive adhesive sheet Yoshio Terada, Tadashi Takahashi, Mitsuhiro Kanada 2020-01-07
10490450 Electrostatic chuck table Sakae Matsuzaki, Noriko Ito, Ken Togashi 2019-11-26
10410901 Electrostatic chuck table using method Yuriko Sato, Sakae Matsuzaki 2019-09-10
9786561 Wafer processing method Yohei Yamashita, Yihui Lee 2017-10-10
9683138 Pressure-sensitive adhesive sheet and magnetic disk drive Yoshio Terada, Kota NAKAO, Akira Hirao, Ryo Morioka 2017-06-20
9478465 Wafer processing method Yohei Yamashita, Yihui Lee 2016-10-25
9093519 Wafer processing method Yohei Yamashita, Yoshiaki Yodo 2015-07-28
9025279 Pressure-sensitive adhesive sheet and magnetic disk drive Rie NAKAHIRA, Yoshihisa Furuta, Koichi Ikeda 2015-05-05
9018080 Wafer processing method 2015-04-28
8865334 Thermally conductive member, and battery device using the same Yoshio Terada, Akira Shouji, Kouki Tomioka, Midori Tojo, Kazunori Hayashi +1 more 2014-10-21
8685839 Workpiece dividing method 2014-04-01
8597812 Thermally conductive member and battery pack device using same Yoshio Terada, Akira Shouji, Kouki Tomioka, Midori Tojo, Kazunori Hayashi +1 more 2013-12-03
8592717 Method of dividing a workpiece having an uneven surface 2013-11-26