Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823942 | Thermocompression bonding method for workpiece | Naoko Yamamoto, Atsushi Kubo | 2023-11-21 |
| 11610815 | Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2023-03-21 |
| 11594454 | Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2023-02-28 |
| 11587833 | Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2023-02-21 |
| 11587832 | Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2023-02-21 |
| 11569129 | Workpiece processing method | Jinyan Zhao | 2023-01-31 |
| 11545393 | Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2023-01-03 |
| 11476161 | Wafer processing method including applying a polyolefin sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-10-18 |
| 11393721 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-07-19 |
| 11380588 | Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-07-05 |
| 11380587 | Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-07-05 |
| 11361997 | Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-06-14 |
| 11348797 | Stacked wafer processing method | Shigenori Harada, Koji Watanabe, Jinyan Zhao | 2022-05-31 |
| 11322406 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-05-03 |
| 11322407 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-05-03 |
| 11302578 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-04-12 |
| 11289379 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-03-29 |
| 11270916 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-03-08 |
| 11251082 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-02-15 |
| 11222807 | Processing method and thermocompression bonding method for workpiece | Naoko Yamamoto, Atsushi Kubo | 2022-01-11 |
| 11127633 | Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheet | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2021-09-21 |
| 11069574 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2021-07-20 |
| 11062948 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2021-07-13 |
| 11056334 | Wafer processing method using a ring frame and a polyester sheet | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2021-07-06 |
| 11049772 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2021-06-29 |